Effect of Water-Cooling Jacket on Thermal Stress of Large-Diameter Silicon Grown by Czochralski Method

Luxi Li,Xiaohan Wan,Wenhui Ma,Shaoyuan Li,Shicong Yang
DOI: https://doi.org/10.1007/s12633-024-03004-w
IF: 3.4
2024-04-30
Silicon
Abstract:The goal of net zero emission accelerates scale application of solar photovoltaic. To achieve grid parity technology iterations in monocrystalline silicon growth by the Czochralski method have made great efforts. The aim of this study is to explore heat transfer and thermal stress induced by water-cooling jacket for 12-inch diameter Cz-Si grown from 40-inch diameter crucible. The numerical simulation results show the point of maximum thermal stress shifts from crystal side surface to center of solid–liquid interface along with increase in the distance between water-cooling jacket and crystal. In spite of decrease in overall heat transfer from the crystal occurring with increased jacket distance, convection heat transfer dominates around the triple point and radiative heat transfer prevails at the greater heights. Deflection of the solid–liquid interface increases with the jacket distance. The distance of 20–30 mm is suggested for minimum thermal stress and uniform distribution.
materials science, multidisciplinary,chemistry, physical
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