Abstract:Sapphire is one of the most widely used substrate materials for semiconductor lighting. With the improvement of chemical mechanical polishing (CMP) processing technology for sapphire substrate, mass production, and cost control requires faster polishing efficiency and better surface quality. In CMP, alumina abrasive is widely used for its high polishing rate, but it also has the disadvantages of easy agglomeration and poor polishing quality. Therefore, ethylenediamine tetraacetic acid (EDTA)-grafted alumina composite abrasives were produced by a two-step process for the sapphire substrate CMP. As demonstrated by time of flight secondary ion mass spectrometry and fourier transform infrared spectroscopy, EDTA has been successfully grafted onto the surface of alumina particles. As shown by the scanning electron microscope, particle size distribution, and zeta potential analyses, the modified alumina composite abrasives exhibit superior dispersion properties than pure alumina particles. CMP experiment results show that the material removal rate (MRR) of the alumina composite abrasives can reach up to 2.6 μm/h, and the surface roughness (Sa) of the sapphire substrate can be reduced to 0.89 nm, which is 53 % higher and 66 % lower than pure alumina, respectively. According to X-ray photoelectron spectroscopy, the chemical etch of modified abrasive particles was strengthened, and the complex reaction occurred throughout the CMP process to generate the C–O–Al structural compound. Meanwhile, the friction coefficient test and contact angle test were combined to create the contact wear model. It shows that the addition of EDTA expands the contact area between the composite abrasives and the surface of substrates, improving the mechanical interaction during CMP. The chemical reaction and mechanical action combine and promote each other to enhance the CMP performance.

Preparation of α-alumina-g-polyacrylamide composite abrasive and chemical mechanical polishing behavior

Preparation of α-alumina/polymethacrylic acid composite abrasive and its CMP performance on glass substrate

Polymer coated γ-aminopropyltriethoxysilane-modified α-alumina non-spherical nanocomposite abrasives and their chemical mechanical polishing behavior on glass-ceramic substrate

Chemical mechanical polishing of hard disk substrate with α-alumina-g-polystyrene sulfonic acid composite abrasive

Preparation of porous alumina/ceria composite abrasive and its chemical mechanical polishing behavior

Preparation of porous alumina abrasives and their chemical mechanical polishing behavior

Preparation of Composite Spherical Alumina Nanoparticles and Study on their CMP Performance

Preparation of Porous Alumina Abrasives with Different Morphologies and their Chemical Mechanical Polishing Behavior

Preparation of alumina/silica core-shell abrasives and their CMP behavior

Improvement in dispersion stability of alumina suspensions and corresponding chemical mechanical polishing performance

Preparation of Ordered Mesoporous Si02/Mc N anocomposite Abrasives and Their Chemical Polishing Behavior on Fused Silicon Substrates

Effect of EDTA-modified alumina composite abrasive on the CMP performance of sapphire substrate

Structure and Properties of Particles/rubber Composites Applied on Functionally Graded Lapping and Polishing Plate

Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

Preparation of copper-incorporated mesoporous alumina abrasive and its CMP behavior on hard disk substrate

AFM and XPS Studies on Material Removal Mechanism of Sapphire Wafer During Chemical Mechanical Polishing (CMP)

High-performance chemical mechanical polishing slurry for aluminum alloy using hybrid abrasives of zirconium phosphate and alumina

Effect of the carboxyl group number of the complexing agent on polishing performance of alumina slurry in sapphire CMP

Chemical Mechanical Polishing of Aluminum Alloys using Alumina-Based Slurry

A special electrostatic self-assembly structure of colloidal silica: Improving Chemical Mechanical Polishing performance

Trivalent lanthanum and ytterbium doped meso-silica/ceria abrasive systems toward chemical mechanical polishing (CMP) and ultraviolet irradiation-assisted photochemical mechanical polishing (PCMP)