On the crystallographic anisotropy of plastic zone size in single crystalline copper under Berkovich nanoindentation

Zhanfeng Wang,Junjie Zhang,Anxin Ma,Alexander Hartmaier,Yongda Yan,Tao Sun
DOI: https://doi.org/10.1016/j.mtcomm.2020.101314
IF: 3.8
2020-12-01
Materials Today Communications
Abstract:<p>Aiming at revealing plastic deformation mechanisms of nanoindentation tests, we investigate the crystallographic orientation-influenced indentation size effect in the Berkovich nanoindentation tests of single crystalline copper, by using the nonlocal crystal plasticity finite element approach and specifically designed experiments. In our simulation model of nanoindentation, a new geometrically necessary dislocation density-based crystal plasticity model is proposed, and the utilized model parameters are calibrated by fitting the measured load-displacement curves of indentation tests. Then the size of plastic zone of indentation tests is defined by the surface pile-up profile, i.e. the diameter of a circle consisting of material points with half of maximum pile-up height. It is found that the modified plastic zone model incorporated with the newly developed scaling factor provides good predication of the indentation depth-dependent hardness of single crystalline copper.</p>
materials science, multidisciplinary
What problem does this paper attempt to address?
This paper aims to address the issue of crystallographic anisotropy in the size of the plastic zone during Berkovich nanoindentation testing of single crystal copper. Specifically, the study investigates the effect of different crystal orientations on the indentation size effect (ISE) through the nonlocal crystal plasticity finite element method (CP-FEM) and specially designed experiments. The research proposes an improved plastic zone model and utilizes newly developed scaling factors to better predict the anisotropy-dependent indentation size effect. Additionally, the study explores the relationship between the size of the plastic zone and crystal orientation, and proposes a new method based on surface pile-up behavior to quantify the scaling factors, thereby enhancing the understanding of ISE characteristics.