Abstract:The implementation of the laser sintering for inkjet-printed nanoparticles and metal organic decomposition (MOD) inks on a flexible polymeric film has been analyzed in detail. A novel approach by implementing, next to a commonly 3.2 mm diameter spot laser optic, a line laser optic with a laser beam area of 2 mm × 80 mm, demonstrates the high potential of selective laser sintering to proceed towards a fast and efficient sintering methodology in printed electronics. In this work, a multiplicity of laser parameters, primary the laser speed and the laser power, have been altered systematically to identify an optimal process window for each ink and to convert the dried and non-conductive patterns into conductive and functional silver structures. For each ink, as well as for the two laser optics, a suitable laser parameter set has been found, where a conductivity without any damage to the substrate or silver layer could be achieved. In doing so, the margin of the laser speed for both optics is ranging in between 50 mm/s and 100 mm/s, which is compatible with common inkjet printing speeds and facilitates an in-line laser sintering approach. Considering the laser power, the typical parameter range for the spot laser lays in between 10 W and 50 W, whereas for the line optics the full laser power of 200 W had to be applied. One of the nanoparticle silver inks exhibits, especially for the line laser optic, a conductivity of up to 2.22 × 107 S‧m−1, corresponding to 36% of bulk silver within a few seconds of sintering duration. Both laser sintering approaches together present a remarkable facility to use the laser either as a digital tool for sintering of defined areas by means of a spot beam or to efficiently sinter larger areas by means of a line beam. With this, the utilization of a laser sintering methodology was successfully validated as a promising approach for converting a variety of inkjet-printed silver patterns on a flexible polymeric substrate into functionalized conductive silver layers for` applications in the field of printed electronics.

Sintering of Copper Nanoparticles using Intense Pulsed Light for screen-printed films on flexible substrate

Kinetic Control of Perovskite Thin-Film Morphology and Application in Printable Light-Emitting Diodes

Optimization of Intense Pulsed Light Sintering Considering Dimensions of Printed Cu Nano/Micro-paste Patterns for Printed Electronics

Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass

Laser Sintering of Various Film Compositions Used in Flexible Printed Electronics

Intensive pulsed light sintered flexible conductive hybrid ink in 3D printed polymers

A comparative study of single and dual sintering processes of metal nanoparticles for flexible electronics application

Ultrafast Laser-Induced Thickness-Limited Sintering of Metal Nanoparticle Film for Ultrathin Flexible Microelectronic Devices

Unraveling the Mechanism of Plasma‐Induced Curing of Particle‐Free Complex Inks for Manufacturing of High‐Performance Flexible Copper Films and Patterns

Silver Nanoparticles Based Ink with Moderate Sintering in Flexible and Printed Electronics

Electron-Beam Irradiation Induced Regulation of Surface Defects in Lead Halide Perovskite Thin Films.

A New Copper Ink With Low Sintering Temperature For Flexible Substrates

Flash Light Sintering of Silver Nanoink for Inkjet-Printed Thin-Film Transistor on Flexible Substrate

Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

Femtosecond and nanosecond laser sintering of silver nanoparticles on a flexible substrate

Laser Sintering by Spot and Linear Optics for Inkjet-Printed Thin-Film Conductive Silver Patterns with the Focus on Ink-Sets and Process Parameters

Multiscale simulation study of laser sintering of inkjet-printed silver nanoparticle inks

Transparent Metal-Mesh heater using Silver-coated copper nanoparticles sintered with intense pulsed light irradiation on PET substrate

Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink

Formulation of Screen-Printable Cu Molecular Ink for Conductive/Flexible/Solderable Cu Traces

Rapid Low Temperature Sintering in Air of Copper Submicron Particles with Synergistic Surface-Activation and Anti-Oxidative Protection