Ultrafast Laser-Induced Thickness-Limited Sintering of Metal Nanoparticle Film for Ultrathin Flexible Microelectronic Devices

Junde Ji,Luchan Lin,Yifan Hu,Weiqing Wu,Xinde Zuo,Zhuguo Li
DOI: https://doi.org/10.1021/acsami.4c14622
IF: 9.5
2024-11-28
ACS Applied Materials & Interfaces
Abstract:Laser sintering of metal nanoparticles (NPs) has been widely used in flexible microelectronic device fabrication, wherein the sintered layer thickness is a key factor affecting the mechanical stability and conductivity. In this work, ultrathin flexible electronic circuits on flexible substrates with robust bonds and excellent conductivity have been fabricated through ultrafast laser-induced thickness-limited sintering of the metal NP film. When the laser fluence is below the damage threshold of...
materials science, multidisciplinary,nanoscience & nanotechnology
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