Abstract:Slicing and post-treatment of SiC crystals have been a significant challenge in the integrated circuit and microelectronics industry. To compete with wire-sawing and mechanical grinding technology, a promising approach combining laser slicing and laser polishing technologies has been innovatively applied to increase utilization and decrease damage defects for single crystal 4H-SiC. Significant material utilization has been achieved in the hybrid laser processes, where material loss is reduced by 75% compared to that of conventional machining technologies. Without any special process control or additional treatment, an internally modified layer formed by laser slicing can easily separate the 4H-SiC crystals using an external force of about similar to 3.6 MPa. The modified layer has been characterized using a micro-Raman method to determine residual stress. The sliced surface exhibits a combination of smooth and coarse appearances around the fluvial morphology, with an average surface roughness of over Sa 0.89 pm. An amorphous phase surrounds the SiC substrate, with two dimensions of lattice spacing, d = 0.261 nm and d = 0.265 nm, confirmed by high-resolution transmission electron microscopy (HRTEM). The creation of laser-induced periodic surface nanostructures in the laser-polished surface results in a flatter surface with an average roughness of less than Sa 0.22 pm. Due to the extreme cooling rates and multiple thermal cycles, dissociation of Si-C bonding, and phase separation are identified on the laser-polished surface, which is much better than that of the machining surface. We anticipate that this approach will be applicable to other high-value crystals and will have promising viability in the aerospace and semiconductor industries.(c) 2023 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.

Wetting behavior of Al on the surface of SiC textured by nanosecond laser

Investigations in the fabrication of surface patterns for wettability modification on a Zr-based bulk metallic glass by nanosecond laser surface texturing

Wetting and spreading behaviors of Al-Si alloy on surface textured stainless steel by ultrafast laser

The effect of surface texturing on the laser-induced wetting behavior of AlSi5 alloy on Ti6Al4V alloy

Ablated surface morphology evolution of SiCp/Al composites irradiated by a nanosecond laser

Effect of picosecond laser texturing on the friction behavior of silicon carbide in hybrid ceramic bearings under dry and water lubrication

Evaluation of structure-chemistry coupling effects for superwetting silicon carbide by laser-based functionalization

Laser-induced dynamic wetting behavior and interfacial evolution of AlSi5 alloy on Ti6Al4V alloy

Femtosecond laser modification of silicon carbide substrates and its influence on CMP process

Laser-induced gradient microstrcutres on Si3N4 ceramics and their wettability analysis

Improving hydrophobicity of laser textured SiC surface with micro-square convexes

Fabricating physicochemical microstructures with super hydrophilicity on Cf/SiC composites surface via picosecond-laser induced ablation

Surface topography by water jet-guided laser texturing on wettability of monocrystalline silicon

Hydrophilic control of laser micro-square-convexes SiC surfaces

Investigations on the ablation behavior of C/SiC under femtosecond laser

Transient Spreading of Water Droplet on Laser Micro-Structured SiC Surfaces

Laser Textured Superhydrophobic SiC Ceramic Surface and the Performance of Condensation Heat Transfer

Influence of surface morphology and processing parameters on polishing of silicon carbide ceramics using femtosecond laser pulses

Investigation on femtosecond laser combined with dynamic wet etching machining of SiC/SiC

Femtosecond laser surface modification coupling with surface metallurgical reaction promotes surface plasticity of SiC

Surface Micromorphology and Nanostructures Evolution in Hybrid Laser Processes of Slicing and Polishing Single Crystal 4H-Sic