Advances on Anti-oxidation Technology of Copper Powder

He Yi-yan

Abstract:The oxidation mechanism of copper powder is reviewed simply. The mechanism and research status of several anti-oxidation technologies of copper powder are introduced emphatically. These technologies are metal plating, organic phosphating, couple agent and reducer treatment,etc.

Chemistry,Materials Science

What problem does this paper attempt to address?

RECENT ADVANCE IN TECHNOLOGY OF ANTI-OXIDATION COPPER POWDER

Guo Zhongcheng

Abstract:The progress in treatment of anti-oxidation copper powder is reviewed.The treatments with metal coating,buffer-corrosion agents,coupling agents,reducers and phosphorization,etc are introduced with analysis of advantages and disadvantages.The further research direction is put forward.

Engineering,Materials Science
Development of Surface Anti-oxidation Treatment on Ultrafine Copper Powder

Huang Congxi

Abstract:The development of surface treatment for ultrafine copper powder including coupling agents, organic acids, organic oxidation inhibitors and plating metals are reviewed. The patent technologies such as surface plating oxides、alloying are introduced. And the oxidizing and anti-oxidizing mechanisms are discussed in this paper. At present the emphasis of the surface treatment is mainly around new methods、new techniques and anti-oxidizing mechanism. The long-term validity and the corrosion resistance in high temperature will be the mainly developmental research direction, and alloying may be the best process to solve oxidation resistance ultimately.

Engineering,Chemistry,Materials Science
A Catalytic Oxidation Approach to Coat Copper Powder with Polyaniline

Yan-hui Guo,Bin-bo Jiang,Ji-zhong Chen,Shi-jie Zhang

DOI: https://doi.org/10.1016/j.surfcoat.2007.06.062

2007-01-01

Abstract:To improve the oxidation resistance of fine copper powder, a new catalytic oxidation method was used to coat copper microparticles with polyaniline. In the method, some copper on the surface of copper particles was converted into Cu2+, and with the catalysis of Cu2+ aniline was oxidized by hydrogen peroxide to form the polyaniline coating layer on copper particles. Detected by field emission scanning electron microscope (FESEM), transmission electron microscope (TEM), Fourier transform infrared spectroscopy (FTIR) and X-ray diffraction (XRD), it is proved that the composite particles have fine core–shell structure, their core are copper particles and their shell are mainly composed of compact polyaniline. The stability of the composites was tested by Thermogravimetric Analyzer (TGA) in nitrogen and in air. It is found that the particulate composite is more stable than copper particles in air.
Anti-oxidation Technique of Conductive Ultrafine Copper Powder

Wang Xuan-jun

Abstract:Oxidized copper powder was coated with an antioxidant which was self-made in the laboratory.The mechanism of the oxides removal from and the coating of the ultrafine oxidized copper power were investigated.IR,XRD and XPS analyses results showed that after pickled with 5% H_2SO_4 and dipped in 0.1%～0.5% anti-oxidant solution at 60℃ for a proper period of time,the surface of the powder was covered with a protective anti-oxidant film which will prevent the surface from environment attach,but don′t affect the conductivity of the powder and the film is stable under 50℃ in 5% H_2SO_4,5%NaOH and 5% NaCl solutions.

Materials Science
Advanced Progress in Treatment and Resource Utilization of Copper Containing Wastewater

Xiang LI,Yaqin WU,Gaoqi ZHANG,Yuanyuan ZHU,Bo YANG,Lin ZHANG

DOI: https://doi.org/10.19672/j.cnki.1003-6504.2018.08.007

IF: 11.4

2018-01-01

Environmental Science & Technology

Abstract:High biological toxicity, low reused efficiency, serious pollution, complex treatment process and high treatment cost were the typical characteristics of copper wastewater. The summary revealed advanced progress in treatment and resource utilization of copper containing wastewater. For summarizing features, advantages and disadvantages of various methods, the review analyzed precipitation, adsorption, electrochemistry, wet oxidation-reduction, ion exchange and Fe/C micro electrolysis. It pointed out that the scheme of integration of special combination processes with resource utilization was the key development direction.
Coating Fine Copper Powder with Polyaniline

Jizhong Chen,Yanhui Guo,Binbo Jiang,Shijie Zhang

DOI: https://doi.org/10.1080/01932690701688490

2008-01-01

Journal of Dispersion Science and Technology

Abstract:To improve the stability of fine copper powder, three methods were tried to coat it with polyaniline. Pretreated, the powder was put into aniline solution. As ammonium persulfate solution was added slowly, aniline changed into polyaniline and coated on copper powder. It is proved that one of the methods is effective and can form good core-shell structure. The shell of the composite contains reduced undoped polyaniline and a little cuprous oxide. The composite has four stages of degradation in nitrogen and is more stable than fine copper powder in air.
Method for preventing oxidization of copper powder

汪锦瑞

2007-10-25

Abstract:The invention provides a method for preventing copper powder from oxidization, and relates to a method of using a compound antioxidant to prevent copper powder from oxidization, which is characterized in that, an antioxidant comprising benzotriazole, triazole and imidazole is added in copper powder to prevent the copper powder from oxidization. The method mixes evenly the antioxidant with the copper powder evenly to form a composite antioxidant, which evaporates slowly and forms a protective film on surfaces of copper powder particles, hence resists oxidization for the copper powder. With the composite antioxidant, the anti-oxidation capability of the copper powder can be up to one year.

Chemistry,Materials Science
Method for preparing antioxidated superfine copper powder

王尚军,方晓祖

2008-11-28

Abstract:A preparation method of anti-oxidation superfine copper powder belongs to the powder technical field. The process flow of the method is as follows: taking soluble divalent cupric salt as a starting material for making cupric salt solution, adding and evenly mixing a dispersant and a trace additive, then adding NaOH solution to the cupric salt solution with the NaOH/Cu mol ratio being 2 to cause the Cu to precipitate as Cu(OH)2, adding a hydrazine hydrate as a reducing agent to obtained jelly with the N2H4/Cu mol ratio being 1.5-2.5 and obtaining pure copper powder by two-stage heat preserving reaction: (1) a first stage: preserving at the temperature of 30-50 DEG C, and converting the Cu(OH)2 into Cu2O after reaction; and (2) a second stage: adjusting pH value of the solution with NaOH to 11-13, heating suspending liquid obtained from the first stage to 60-70 DEG C, keeping the temperature until the reaction is finished to obtain the pure copper powder, and then cleaning and drying the copper powder by centrifugal separation. The raw materials used in the method are cheap and available, and the superfine copper powder with the average particle size below 0.5 micron prepared by the method does not need any anti-oxidation treatment, does not discolor after being kept in the air for more than one year, has anti-oxidation temperature of more than 100 DEG C proved by thermogravimetric analysis and is especially suitable for being used as an electronic material.

Materials Science
Preparation and anti-oxidisation resistance of silver-coated copper powders by cobalt-modified copper powders

Fei Han,Mei Cao,Jiali Lin,Ting Liu,Xiaoxin Zhu

DOI: https://doi.org/10.1177/02670836241234020

IF: 1.8

2024-03-05

Materials Science and Technology

Abstract:Spherical copper powders and cobalt-modified copper powders were electroless plated with silver, respectively, to obtain two kinds of silver-plated copper powders. The composite powders were analysed by X-ray diffraction, X-ray photoelectron spectroscopy, scanning electron microscopy and thermogravimetric-differential scanning calorimetry. Effects of cobalt modification on surface morphology, silver reduction rate, particle size and anti-oxidisation resistance of composite powders were studied. The results indicate that surface morphology of silver-coated copper powders prepared by cobalt-modified copper powders was affected by cobalt, but the size, mass and the percent reduction of silver were significantly increased under the same conditions of electroless plating silver. And silver-coated copper powders prepared by cobalt-modified copper powders have better anti-oxidisation resistance than silver-coated copper powders prepared by copper powders.

materials science, multidisciplinary,metallurgy & metallurgical engineering
A Novel Antioxidation Treatment Method for Micron/Nano Copper Materials in Semiconduct Field

Yu Zhang,C. Cui,Qiang Liu,Ziyuan Chen

DOI: https://doi.org/10.1109/ICEPT50128.2020.9202453

2020-08-01

Abstract:Micro-nano copper powder is the potential interconnect materials of application in the third generation of high-power semiconductor devices, micro-nano copper powder, but easy to be oxidized in the air environment, this feature will seriously affect the widely use of micro nano copper powder and the interconnection reliability after sintering. Therefore, there is an urgent need to find a method that can effectively improve the oxidation resistance and sintering performance of micro-nano copper powder. In this paper, a novel method for the treatment of micro-nano copper powder was proposed, in which the surface oxide of micro-nano copper powder was first rinsed, followed by the addition of imidazole compounds ethanol solution, which was stirred continuously at 60°C for 10 minutes to make the imidazole compounds fully react with micro-nano copper powder. The XRD test of the obtained micro-nano copper powder found that the treated micro-nano copper powder did not appear to oxidize significantly after being left in an air environment for 30 days. After sintering of micro-nano copper powder, the shear test found that the maximum shear strength reached 42.31MPa, which has good shear characteristics.

Engineering,Materials Science
Anti-oxidant process of copper powder by using tannic acid in conjunctions with hydrazine

정헌생,호앙트리하이,김동진,이재령,안종관

2004-11-10

Abstract:The present invention relates to a method for preventing surface oxidation of the copper powder using a hydrazine and tannic acid, and its object is cleanness and uniformity of the conductivity and the surface of the copper powder, thereby suppressing re-oxidation of removing the oxide layer of the copper powder surface and oxidation layer securing the property to provide an anti-oxidation method for establishing a production technology of copper powder having excellent performance as an electronic material and alloy material. The configuration of the present invention is hydrazine and heated according to a method for preventing oxidation of the copper powder using a tannin, while the copper powder was stirred was added in a constant temperature reaction bath containing the the NH Copper powder, hydrazine, tannic acid, Act oxide, the surface oxide, electronic materials

Chemistry,Materials Science
Preparation and anti-oxidation properties of carbon-coated copper nanoparticles

Ningning Xin

Abstract:Four different kinds of carbon-coated copper nanoparticles were synthesized by carbon arc discharge method using powder mixtures containing copper and graphite with mass ratios of graphite to copper of 4:1,3:2,2:3,1:4,respectively.The structures,topographies,size distributions,phase compositions and anti-oxidation properties of those nanoparticles were characterized by X-ray diffratometry(XRD),transmission electron microscopy(TEM),thermogravimetric analysis(TGA) and differential scanning calorimety(DSC),respectively.And the factors influencing the particles size and the yield of carbon coated copper nanoparticles were also discussed.The results indicate that the carbon-coated copper nanoparticles show clear core-shell structure,the cores of the particles are copper,and shells of the particles are graphite carbon layers.The sizes of carbon coated copper nanoparticles are 20?60 nm,and the sizes of nanoparticles increase with increasing the copper content in sample electrode,meanwhile,the particles sizes increase accompanying the increase of the discharge current and reaction pressure.The yield of carbon coated-copper nanoparticles increases with the increase of the copper content,while reaction gas pressure has no significant effect on the yield.And with the increase of copper content,the inner copper core has a trend of further crystallization.Copper possesses catalysis to the external carbon layers,and the graphitization degree becomes more obvious as the content of copper increases.The outside graphitic carbon layers effectively prevent unwanted oxidation of the copper inside.The anti-oxidation property of carbon-coated copper nanoparticles is superior to that of the pure copper powder.

Chemistry,Materials Science
Effect of antioxidant-treated copper powder on friction properties of polytetrafluoroethylene

Wei Xiao,Xin Ji

DOI: https://doi.org/10.1007/s13726-021-00903-2

IF: 2.485

2021-02-11

Iranian Polymer Journal

Abstract:Polytetrafluoroethylene (PTFE) has many excellent properties and wide applications, but its low wear resistance limits its use. Copper powder and antioxidants were mixed and composite samples were prepared by high-temperature sintering method to investigate the influence of antioxidants content on friction performance of the composite materials. A friction and wear testing machine was used to test the friction and wear performance, and a scanning electron microscope (SEM) was applied to analyze the composites surface morphology their wear positions. The results showed that antioxidants content greatly influenced the composites tribological wear performance. In the theoretical simulation, ANSYS software was used to simulate the antioxidant content effect on thermal conductivity, friction and wear properties of the composite materials. The simulation data were compared with the experimental results. The theoretical simulation data showed that the model could simulate friction and wear experimental processes accurately. Both results were consistent, which proved the reliability of the theoretical analysis.

polymer science
Fabrication and performance of silver coated copper powder

Xiao Guo Cao,Hai Yan Zhang

DOI: https://doi.org/10.1007/s13391-012-1110-6

IF: 3.151

2012-08-01

Electronic Materials Letters

Abstract:Electroless silver coating on copper powder and its effects on oxidation resistance were investigated by varying the fabrication parameters. Using acetylacetone (C5H8O2) as chelating reagent, silver-coated copper powder was fabricated by displacement reaction method. In the process, acetylacetone forms chelating compound with Cu 2+, which prevent the formation of [Cu (NH3)4]2+. Therefore, Ag + can be reduced continully and deposited on the surface of copper particles. As-coated copper particles were characterized using x-ray diffraction (XRD), scanning electron microscopy (SEM) and x-ray energy dispersive spectroscopy (EDS). The oxidation resistance of silver coated copper powder was investigated by gravimetric method. It was found that a fairly continuous silver layer was formed on the surface of copper powder by the electroless type of substitution plating. When the silver content reached 10 wt. %, silver was homogeneously distributed around the copper particles and few free silver particles were detected. The results showed that the silver coated copper powder with the best oxidation resistance was prepared at 40°C and the C5H8O2/AgNO3 molar ratio was 1:1.

materials science, multidisciplinary
Enhanced Anti-Oxidation Copper-Based Conductive Inks for Low Porosity Copper Films in Power Electronics

Mingming Yi,Wenhui Zhu,Ping Wu,Yiou Qiu,Guoliao Sun,Liancheng Wang

DOI: https://doi.org/10.1109/tcpmt.2024.3417261

2024-08-21

IEEE Transactions on Components Packaging and Manufacturing Technology

Abstract:Copper-based conductive inks have been extensively researched due to their low sintering temperature and high anti-oxidation properties for various electrical devices. However, the unstable oxidation properties of copper (Cu) limit its practical application. The existing anti-oxidation methods adopted in copper sintering often reduce copper strength and reliability. Therefore, the study presents a novel copper composite ink comprising copper precursors, copper microparticles, organic protective agents, and antioxidants. The sintering process is simple, requiring only 20 min at C in nitrogen without any additional pressure. As a result, sintered copper with an oxidation rate of only 3.21 wt% was successfully obtained using the mixed ink of copper particles and precursors. The porosity of the sintered copper is 10.69%, which is a 71.77% reduction compared to the copper sintered by using pure copper precursor ink, due to the synergistic effect. Furthermore, the study discusses and analyzes the lattice growth mechanism and synergy mechanism of copper particles and their precursors during copper sintering.

engineering, manufacturing, electrical & electronic,materials science, multidisciplinary
Preparation of silver-coated copper powder and its oxidation resistance research

Xiao Guo Cao,Hai Yan Zhang

DOI: https://doi.org/10.1016/j.powtec.2012.04.012

IF: 5.64

2012-08-01

Powder Technology

Abstract:Electroless silver coating on copper powder and its effects on oxidation resistance were investigated. In general, silver-coated copper powder is prepared by an electroless type of substitution plating making use of the substitution reaction between copper and silver. However, [Cu (NH3)4]2+ is produced during the electroless plating process and absorbed onto the surface of the copper particles, which prevent substitution reactions proceeding. In the new electroless plating process, RE-608 copper-specific extractant was used as chelating reagent to formed chelate compound with Cu2+ and the chelate compound was extracted to organic phase, which confirmed substitution reaction to be proceeding. As-coated copper particles were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). When the silver content reached 6.86wt.%, silver was homogeneously distributed around the copper particles and few free silver particles were detected. The results indicated that the properties of oxidation resistance were improved with increasing the dosage of RE-608 copper-specific extractant and reaction time, and with decreasing AgNO3 concentration. It was also found that the optimum reaction temperature was 80°C.

engineering, chemical
Performance improvement and application of copper-based nanomaterials in membrane technology for water treatment: A review

Shuli Liu,Haoyi Guo,Zhihui Kong,Xiaohong Han,Yatong Gao,Yuhong Zhang,Glen T Daigger,Peng Zhang,Jia Kang,Shuchun Yu,Guoting Li,Gangfu Song

DOI: https://doi.org/10.1016/j.jenvman.2024.122755

Abstract:Membrane fouling, including organic, inorganic, and biological fouling, poses enormous challenges in membrane water treatment. Incorporation of copper-based nanomaterials in polymeric membranes is highly favored due to their exceptional antibacterial properties and capacity to improve membrane hydrophilicity. This review extensively explores the utilization of copper-based nanomaterials in membrane technology for water treatment, with a specific focus on enhancing anti-fouling performance. It elaborates on how copper-based nanomaterials improve the surface properties of membrane materials (such as porosity, hydrophilicity, surface charge, etc.) through physical and chemical processes. It summarizes the properties and potential antibacterial mechanisms of copper-based nanomaterials, primarily by disrupting microbial cell structures through the generation of reactive oxygen species (ROS). Furthermore, recent efforts to enhance the environmental sustainability, cost-effectiveness, and recyclability of copper-based nanomaterials are outlined. The attempts to offer insights for the advancement of anti-fouling practices in water treatment through the use of copper-modified polymer membranes.
Hydrothermal treatment of submicrometer copper powders for the improved anti-oxidative capacity

Dan Zhao,Jiajia Zou,Dongping Yin,Wencheng Hu,Ni Wang

DOI: https://doi.org/10.1080/14328917.2020.1747170

2020-03-31

Materials Research Innovations

Abstract:Copper submicrometer particles have been synthesised via a hydrothermal treatment. The precursor is obtained by means of the reaction of chemical reduction method. The copper powders studied by powder X-ray diffraction exhibit a perfect crystallinity with a lattice constant of 3.629 Ǻ. Meanwhile, the scanning electron microscope photomicrographs and particle size distribution reveal that the powders have an average particle size of 0.4 μm with narrow size distribution. The differential thermal analysis curves indicate that initial oxidation temperature is greatly improved from 212°C to 272°C after hydrothermal treatment, indicating the antioxidant ability of the copper submicrometer particles synthesised by hydrothermal treatment increased obviously.
Research Progress on Electroless Copper Plating

TIAN Qing-hua,YAN Jian-feng,GUO Xue-yi

DOI: https://doi.org/10.3969/j.issn.1004-227x.2007.04.012

2007-01-01

Abstract:In recent years,the status of electroless copper plating technique is rising constantly in surface treating industry,which is more and more extensive applied in several fields including electronics industry,mechanical industry,aerospace,etc.The investigation on the mechanism of electroless copper plating and process improvement have become one of the most interesting topics.In this paper,the general situation and the recent research progress of electroless copper plating were introduced.Some new advanced technologies were reviewed.The future research directions were presented.
Surface coordination layer passivates oxidation of copper

Jian Peng,Bili Chen,Zhichang Wang,Jing Guo,Binghui Wu,Shuqiang Hao,Qinghua Zhang,Lin Gu,Qin Zhou,Zhi Liu,Shuqin Hong,Sifan You,Ang Fu,Zaifa Shi,Hao Xie,Duanyun Cao,Chang-Jian Lin,Gang Fu,Lan-Sun Zheng,Ying Jiang,Nanfeng Zheng

DOI: https://doi.org/10.1038/s41586-020-2783-x

IF: 64.8

2020-10-14

Nature

Abstract:Owing to its high thermal and electrical conductivities, its ductility and its overall non-toxicity<a href="#ref-CR1">1</a>,<a href="#ref-CR2">2</a>,<a href="/articles/s41586-020-2783-x#ref-CR3">3</a>, copper is widely used in daily applications and in industry, particularly in anti-oxidation technologies. However, many widespread anti-oxidation techniques, such as alloying and electroplating<a href="/articles/s41586-020-2783-x#ref-CR1">1</a>,<a href="/articles/s41586-020-2783-x#ref-CR2">2</a>, often degrade some physical properties (for example, thermal and electrical conductivities and colour) and introduce harmful elements such as chromium and nickel. Although efforts have been made to develop surface passivation technologies using organic molecules, inorganic materials or carbon-based materials as oxidation inhibitors<a href="#ref-CR4">4</a>,<a href="#ref-CR5">5</a>,<a href="#ref-CR6">6</a>,<a href="#ref-CR7">7</a>,<a href="#ref-CR8">8</a>,<a href="#ref-CR9">9</a>,<a href="#ref-CR10">10</a>,<a href="#ref-CR11">11</a>,<a href="/articles/s41586-020-2783-x#ref-CR12">12</a>, their large-scale application has had limited success. We have previously reported the solvothermal synthesis of highly air-stable copper nanosheets using formate as a reducing agent<a href="/articles/s41586-020-2783-x#ref-CR13">13</a>. Here we report that a solvothermal treatment of copper in the presence of sodium formate leads to crystallographic reconstruction of the copper surface and formation of an ultrathin surface coordination layer. We reveal that the surface modification does not affect the electrical or thermal conductivities of the bulk copper, but introduces high oxidation resistance in air, salt spray and alkaline conditions. We also develop a rapid room-temperature electrochemical synthesis protocol, with the resulting materials demonstrating similarly strong passivation performance. We further improve the oxidation resistance of the copper surfaces by introducing alkanethiol ligands to coordinate with steps or defect sites that are not protected by the passivation layer. We demonstrate that the mild treatment conditions make this technology applicable to the preparation of air-stable copper materials in different forms, including foils, nanowires, nanoparticles and bulk pastes. We expect that the technology developed in this work will help to expand the industrial applications of copper.

multidisciplinary sciences

Advances on Anti-oxidation Technology of Copper Powder

RECENT ADVANCE IN TECHNOLOGY OF ANTI-OXIDATION COPPER POWDER

Development of Surface Anti-oxidation Treatment on Ultrafine Copper Powder

A Catalytic Oxidation Approach to Coat Copper Powder with Polyaniline

Anti-oxidation Technique of Conductive Ultrafine Copper Powder

Advanced Progress in Treatment and Resource Utilization of Copper Containing Wastewater

Coating Fine Copper Powder with Polyaniline

Method for preventing oxidization of copper powder

Method for preparing antioxidated superfine copper powder

Preparation and anti-oxidisation resistance of silver-coated copper powders by cobalt-modified copper powders

A Novel Antioxidation Treatment Method for Micron/Nano Copper Materials in Semiconduct Field

Anti-oxidant process of copper powder by using tannic acid in conjunctions with hydrazine

Preparation and anti-oxidation properties of carbon-coated copper nanoparticles

Effect of antioxidant-treated copper powder on friction properties of polytetrafluoroethylene

Fabrication and performance of silver coated copper powder

Enhanced Anti-Oxidation Copper-Based Conductive Inks for Low Porosity Copper Films in Power Electronics

Preparation of silver-coated copper powder and its oxidation resistance research

Performance improvement and application of copper-based nanomaterials in membrane technology for water treatment: A review

Hydrothermal treatment of submicrometer copper powders for the improved anti-oxidative capacity

Research Progress on Electroless Copper Plating

Surface coordination layer passivates oxidation of copper