Optimization on Thermomechanical Behavior for Improving the Reliability of Press Pack IGBT Using Response Surface Method

Hui Li,Renze Yu,Ran Yao,Xiao Wang,Jinyuan Li,Renkuan Liu,Yue Yu,Xianping Chen
DOI: https://doi.org/10.1109/jestpe.2021.3078891
IF: 5.462
2021-10-01
IEEE Journal of Emerging and Selected Topics in Power Electronics
Abstract:A press pack insulated gate bipolar transistor (PP IGBT) device consists of multiple materials. Under the influence of alternating current and clamping force, the device suffers from complex thermomechanical stress. However, the experience-based packaging design does not consider the coupling effect of junction temperature fluctuation ( <span class="mjpage"><svg xmlns:xlink="http://www.w3.org/1999/xlink" width="14.075ex" height="2.843ex" style="vertical-align: -1.005ex;" viewBox="0 -791.3 6060 1223.9" role="img" focusable="false" xmlns="http://www.w3.org/2000/svg"><g stroke="currentColor" fill="currentColor" stroke-width="0" transform="matrix(1 0 0 -1 0 0)"> <use xlink:href="#MJMATHI-44" x="0" y="0"></use> <use xlink:href="#MJMATHI-65" x="828" y="0"></use> <use xlink:href="#MJMATHI-6C" x="1295" y="0"></use> <use xlink:href="#MJMATHI-74" x="1593" y="0"></use> <use xlink:href="#MJMATHI-61" x="1955" y="0"></use><g transform="translate(2484,0)"> <use xlink:href="#MJMATHI-54" x="0" y="0"></use><g transform="translate(584,-150)"> <use transform="scale(0.707)" xlink:href="#MJMATHI-6D" x="0" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-61" x="878" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-74" x="1408" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-68" x="1769" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-72" x="2346" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-6D" x="2797" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-6A" x="3676" y="0"></use></g></g></g></svg></span> ) and mechanical stress, which may not ensure the optimal thermomechanical behavior and cause the advance failure of the PP IGBT device. Thus, it is significant to provide a theoretical basis and select appropriate parameters for device packaging design. In this article, a finite-element model of a 3300-V/50-A PP IGBT device is first built and verified via experiments. The influence of principal parameters on the thermomechanical behavior is then illustrated. Next, the response surface method is proposed to reveal the significance level of each parameter. According to simulation results under different combinations of parameters, quadratic response surfaces are obtained. The combined effects of packaging parameters on <span class="mjpage"><svg xmlns:xlink="http://www.w3.org/1999/xlink" width="14.075ex" height="2.843ex" style="vertical-align: -1.005ex;" viewBox="0 -791.3 6060 1223.9" role="img" focusable="false" xmlns="http://www.w3.org/2000/svg"><g stroke="currentColor" fill="currentColor" stroke-width="0" transform="matrix(1 0 0 -1 0 0)"> <use xlink:href="#MJMATHI-44" x="0" y="0"></use> <use xlink:href="#MJMATHI-65" x="828" y="0"></use> <use xlink:href="#MJMATHI-6C" x="1295" y="0"></use> <use xlink:href="#MJMATHI-74" x="1593" y="0"></use> <use xlink:href="#MJMATHI-61" x="1955" y="0"></use><g transform="translate(2484,0)"> <use xlink:href="#MJMATHI-54" x="0" y="0"></use><g transform="translate(584,-150)"> <use transform="scale(0.707)" xlink:href="#MJMATHI-6D" x="0" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-61" x="878" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-74" x="1408" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-68" x="1769" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-72" x="2346" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-6D" x="2797" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-6A" x="3676" y="0"></use></g></g></g></svg></span> and stress are clarified. Finally, optimal results are derived and verified. An approximate 4 °C decrease in <span class="mjpage"><svg xmlns:xlink="http://www.w3.org/1999/xlink" width="14.075ex" height="2.843ex" style="vertical-align: -1.005ex;" viewBox="0 -791.3 6060 1223.9" role="img" focusable="false" xmlns="http://www.w3.org/2000/svg"><g stroke="currentColor" fill="currentColor" stroke-width="0" transform="matrix(1 0 0 -1 0 0)"> <use xlink:href="#MJMATHI-44" x="0" y="0"></use> <use xlink:href="#MJMATHI-65" x="828" y="0"></use> <use xlink:href="#MJMATHI-6C" x="1295" y="0"></use> <use xlink:href="#MJMATHI-74" x="1593" y="0"></use> <use xlink:href="#MJMATHI-61" x="1955" y="0"></use><g transform="translate(2484,0)"> <use xlink:href="#MJMATHI-54" x="0" y="0"></use><g transform="translate(584,-150)"> <use transform="scale(0.707)" xlink:href="#MJMATHI-6D" x="0" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-61" x="878" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-74" x="1408" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-68" x="1769" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-72" x="2346" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-6D" x="2797" y="0"></use> <use transform="scale(0.707)" xlink:href="#MJMATHI-6A" x="3676" y="0"></use></g></g></g></svg></span> and a 19.8% decrease in stress are achieved simultaneously in the long-time power cycling test. 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engineering, electrical & electronic
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