Effects of annealing on the interfacial properties and energy-band alignment of AlN dielectric on 4H–SiC

Zhanwei Shen,Feng Zhang,Jun Chen,Zhao Fu,Xingfang Liu,Guoguo Yan,Bowen Lv,Yinshu Wang,Lei Wang,Wanshun Zhao,Guosheng Sun,Yiping Zeng
DOI: https://doi.org/10.1063/5.0018330
IF: 4
2020-09-08
Applied Physics Letters
Abstract:Interfacial properties and energy-band alignment of annealed AlN dielectric films on Si-face 4° off-axis 4H–SiC substrates were characterized and demonstrated by x-ray photoelectron spectroscopy (XPS) and current-electric field (<i>I–E</i>) measurements. The XPS results reveal that the Al–O bonds and the silicon suboxides can convert into more stable Al–N bonds and Al–O–Si bonds at the AlN/4H–SiC interface under 1000 °C annealing. The variations in both oxygen-rich composition and the crystallinity in AlN make annealing-dependent conduction band offsets of as-deposited and annealed AlN/4H–SiC to be 1.36 eV and 1.20 eV, respectively. Meanwhile, <i>I–E</i> measurements separately yield the occurrence of the Fowler–Nordheim (FN) tunneling and space-charge-limited conduction in as-deposited and annealed metal-insulator-semiconductor capacitors, corresponding to lower barrier heights of 0.92 eV and 0.54 eV, respectively. The reason for the energy-band shift between <i>I–E</i> derivations and the XPS results was analyzed and demonstrated together. These results can provide considerable insight into the energy-band alignment of AlN as gate dielectric or passivation layers on 4H–SiC based devices.
physics, applied
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