Thermal-assisted electroforming enables performance improvement by suppressing the overshoot current in amorphous carbon-based electrochemical metallization memory

Qiaoling Tian,Xiaoning Zhao,Xiaohan Zhang,Huai Lin,Di Wang,Guozhong Xing,Zhongqiang Wang,Ya Lin,Haiyang Xu,Yichun Liu
DOI: https://doi.org/10.1063/5.0065658
IF: 4
2021-10-04
Applied Physics Letters
Abstract:A thermal-assisted electroforming (TAE) method is proposed to address the current overshoot issue and improve the resistive switching (RS) performance of electrochemical metallization (ECM) memory with a Cu/amorphous carbon (a-C)/Pt structure. In the initial electroforming process, thermal treatment can promote the electrochemical formation of metallic conductive filament (CF). The required electroforming voltage is reduced, and the undesirable overshoot current is suppressed. As a result, the RS performance of the cell is improved, including reduced RS parameter fluctuations, enlarged off/on ratio, and enhanced cycling endurance. The cell can be operated with a low compliance current (ICC) of 50 μA, which is among the lowest value of reported a-C-based ECM memories. Benefit from the low ICC, multilevel memory with five nonvolatile resistance states in a single cell is obtained. The main role of the TAE method is interpreted as to avoid the extreme high-temperature caused by the overshoot current. Conductive-atomic force microscopy mapping implies that the suppression of overshoot current can avoid over-injection of Cu cations into the a-C layer, facilitating CF with a simple structure and low randomness. The present work offers a feasible approach for addressing the current overshoot issue and improving the performance of ECM memory.
physics, applied
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