Heat transfer enhancement for 3D chip thermal simulation and prediction

Chao Wang,Kambiz Vafai
DOI: https://doi.org/10.1016/j.applthermaleng.2023.121499
IF: 6.4
2023-09-09
Applied Thermal Engineering
Abstract:Parameter changes in the complex internal structure of multi-layer 3D stacked chips will greatly reduce the efficiency of modeling and thermal analysis. In this work, by combining thermal simulation analysis with machine learning algorithms, we can skillfully predict the hotspot temperature changes of 3D chips up to 28 layers while changing some key parameters of 3D chips with less computational effort. K-fold Cross Validation (K-CV) algorithm and support vector regression (SVR) algorithm were developed to predict the variations in hotspot temperature of the 3D chip while changing modeling and cooling parameters. Based on the training matrix, the support vector regression (SVR) model can accurately predict the random power distribution case, the random processor core location distribution case, and the random Through Silicon Via (TSV) distribution case. The validation results show that the prediction accuracy deviation is close to 0.6 K, and the correlation coefficient R 2 is close to 1. Meanwhile, the variable parameter and variable layer prediction method based on the aforementioned training model can more accurately predict the hotspot temperature of the 3D chips with higher layers (28 layers) from the modeling analysis data of 3D chips with lower layers (4–5 layers). Its prediction deviation is less than 0.2%. The predicted data match the simulated numerical data quite well, indicating that the predictive algorithm can accurately feed the sample data set.
energy & fuels,engineering, mechanical,thermodynamics,mechanics
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