Abstract:Deep learning is a subset of machine learning that focuses on complex non-linear processing of data. These frameworks are central to emerging technologies like automated driving and medical imaging but could also be applied to thermal management challenges to reduce computational time and enable real-time predictions of temperature and power during operation of electronic devices. In this paper, we leverage convolutional neural network (CNN) frameworks to (1) predict the temperature map given the power distribution on the heated surface (i.e., the forward problem), and (2) predict the power distribution given a temperature map of the exposed surface in a silicon die (i.e., the inverse problem). The forward problem is solved using two CNN architectures. For a given power map, the first CNN predicts the range of temperatures on the heated surface (that is, the hottest and coolest temperatures), while the second CNN predicts the normalized spatial temperature distribution throughout this surface. This normalized distribution is then scaled using the temperatures estimated by the first CNN to predict the absolute temperature map. The predictions of minimum and maximum temperatures have an MAE of less than 0.5° C, with the combined framework to predict temperature distributions having an MAE of less than 1°C. The inverse problem is solved using a modified U-Net architecture that uses a popular pre-trained encoder MobileNetV2, and decoder blocks from the pix2pix framework. The MAE between the input temperature maps and those resulting from the predicted power maps is 1.4° C with an error in the normalized distribution of only 2%. With an inference time of 5 milliseconds (forward problem) and 14 milliseconds (inverse problem) on a commercial processor, this analysis shows potential for deployment on-chip for real-time temperature distribution predictions or for integration with inverse algorithms to predict power distributions.

Estimation of steady-state temperature field in Multichip Modules using deep convolutional neural network

Transfer learning of convolutional neural network model for thermal estimation of multichip modules

Fast optimization of multichip modules using deep learning coupled with Bayesian method

DaDianNao: A Machine-Learning Supercomputer

Heat Flux Prediction of Radiation Balance Wall by Deep Convolutional Neural Networks

Deep Learning for Real-Time Chip Temperature and Power Predictions

Transient Thermal Analysis of Chiplet-Based Systems with Dual-Channel Message Passing Neural Networks

Dynamic Thermal Management for 3-D ICs with Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

A novel PoI temperature prediction method for heat source system based on graph convolutional networks

Three-dimensional Thermal Modeling Method of Power Device Chip Based on Intelligent Algorithm

A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects

Prediction of IC Equivalent Magnetic Dipoles Using Deep Convolutional Neural Network

EMI Radiation Prediction of Packages Based on Convolution Neural Network

Heat transfer enhancement for 3D chip thermal simulation and prediction

Multi-scale collaborative modeling and deep learning-based thermal prediction for air-cooled data centers: An innovative insight for thermal management

DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design

Application of Imagery Modeling and Deep Learning in Chip Thermal Analysis

Investigation on the Thermal Characteristics of Electronic System and Prediction of Chip Temperature by Machine Learning

An HC and Deep MIM Enhanced PINN SciML Algorithm for the Transient Thermal Analysis of 3-D Packages of Integrated Circuits

Quick Prediction of Complex Temperature Fields Using Conditional Generative Adversarial Networks

LSTM-based Temperature Prediction and Hotspot Tracking for Thermal-aware 3D NoC System.