Abstract:Deep learning is a subset of machine learning that focuses on complex non-linear processing of data. These frameworks are central to emerging technologies like automated driving and medical imaging but could also be applied to thermal management challenges to reduce computational time and enable real-time predictions of temperature and power during operation of electronic devices. In this paper, we leverage convolutional neural network (CNN) frameworks to (1) predict the temperature map given the power distribution on the heated surface (i.e., the forward problem), and (2) predict the power distribution given a temperature map of the exposed surface in a silicon die (i.e., the inverse problem). The forward problem is solved using two CNN architectures. For a given power map, the first CNN predicts the range of temperatures on the heated surface (that is, the hottest and coolest temperatures), while the second CNN predicts the normalized spatial temperature distribution throughout this surface. This normalized distribution is then scaled using the temperatures estimated by the first CNN to predict the absolute temperature map. The predictions of minimum and maximum temperatures have an MAE of less than 0.5° C, with the combined framework to predict temperature distributions having an MAE of less than 1°C. The inverse problem is solved using a modified U-Net architecture that uses a popular pre-trained encoder MobileNetV2, and decoder blocks from the pix2pix framework. The MAE between the input temperature maps and those resulting from the predicted power maps is 1.4° C with an error in the normalized distribution of only 2%. With an inference time of 5 milliseconds (forward problem) and 14 milliseconds (inverse problem) on a commercial processor, this analysis shows potential for deployment on-chip for real-time temperature distribution predictions or for integration with inverse algorithms to predict power distributions.

Investigation on the Thermal Characteristics of Electronic System and Prediction of Chip Temperature by Machine Learning

Three-dimensional Thermal Modeling Method of Power Device Chip Based on Intelligent Algorithm

Machine Learning for 3D-IC Electric-Thermal Simulation and Management

Heat transfer enhancement for 3D chip thermal simulation and prediction

A Predictive Model for Temperature Rise of Spindle–Bearing Integrated System

An Artificial Neural Network Model for Electro-Thermal Effect Affected Hot Carrier Injection Reliability in 14-nm FinFETs

Dynamic Thermal Management for 3-D ICs with Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

Efficient Multi-Channel Thermal Monitoring and Temperature Prediction Based on Improved Linear Regression

Comprehensive Thermal Resistance Model of Forced Air Cooling System for Multiple Power Chips

Temperature Estimation Model and Applications to Thermal-Aware Test Scheduling

A Simulation Software for Predicting Thermal Performance of Embedded Components

Accurate Runtime Thermal Prediction Scheme For 3d Noc Systems With Noisy Thermal Sensors

Thermal challenges in heterogeneous packaging: Experimental and machine learning approaches to liquid cooling

Deep Learning for Real-Time Chip Temperature and Power Predictions

Combinatorial Atomistic-to-ai Prediction and Experimental Validation of Heating Effects in 350 F Supercapacitor Modules

Quick Prediction of Complex Temperature Fields Using Conditional Generative Adversarial Networks

Real-Time Temperature Prediction of Power Devices Using an Improved Thermal Equivalent Circuit Model and Application in Power Electronics

A Thermal Machine Learning Solver For Chip Simulation

DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design

Thermal Modeling of Power Semiconductor Devices with Heat Sink Considering Ambient Temperature Dynamics

Estimation of steady-state temperature field in Multichip Modules using deep convolutional neural network