Abstract:With the rapid increase of the transistor number in VLSI, rapidly rising power density and temperatures make heat dissipation a major challenge in IC design and manufacturing. However, conventional deterministic thermal analysis methods have difficulties in obtaining local temperature solutions efficiently, and the existing stochastic method is inaccurate when dealing with thermal analysis problems involving Robin boundary conditions. In this paper, a highly parallelized path integral random walk (PIRW) solver is innovatively proposed for steady-state thermal analysis with mixed boundary conditions, especially Robin boundary conditions. The rigorous calculation of the local time and the Feynman-Kac functional êc(t) are adopted to accurately handle Neumann and Robin boundary conditions for the first time. Furthermore, based on the PIRW, we propose an accurate and microsecond-level pre-calculation PIRW (pPIRW) predictor, which pre-calculates time-consuming random walks, obtains temperatures by simple vector multiplication, and therefore is suitable for proactive thermal management. The pPIRW essentially calculates a partial inverse of large-scale matrices constructed from the finite difference-based compact thermal models (CTMs). Experimental results show that compared with 3D-ICE, the PIRW solver maintains high accuracy with a negligible error within 0.5°C, achieves 136-209× speedup and 8.53-11.1× storage space reduction with all three kinds of boundary conditions, and decreases to 1-1.53× speedup for lacking the absorbing Dirichlet boundary. The pPIRW further has speed improvement of 2.5e4-6.7e6× and memory reduction of 36.6-42.5× over PIRW without loss of accuracy. Integrated within a thermal management strategy, the pPIRW predictor can eliminate all thermal conflicts while maintaining the highest working frequency. Meanwhile, pPIRW achieves 29.2× speedup and 634× memory reduction over the CTM during the offline pre-calculation stage.

Self-Adapting Power Density Sampling for On-Chip Thermal Prediction With Transistor-Level Granularity

Self-adaptive Passive Temperature Management for Silicon Chips Based on Near-Field Thermal Radiation

Adaptive Chip-Package Thermal Analysis for Synthesis and Design

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Adaptive Multi-Domain Thermal Modeling and Analysis for Integrated Circuit Synthesis and Design

Dynamic Thermal Management for 3-D ICs with Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

Inverse Distance Weighting Method Based on a Dynamic Voronoi Diagram for Thermal Reconstruction with Limited Sensor Data on Multiprocessors

A Low Computational Cost and Accurate Thermal Calculation Method for Multi-hotspot IC

Surface Spline Interpolation Method for Thermal Reconstruction with Limited Sensor Data of Non-Uniform Placements

Ultrafast Temperature Profile Calculation in Ic Chips

Regulating CPU Temperature With Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model

Ppirw: an Efficient and Accurate Pre-calculation Path Integral Random Walk Solver for Steady-State Thermal Simulation with Robin Boundary Conditions

Temperature-aware microarchitecture

Heat transfer enhancement for 3D chip thermal simulation and prediction

Temperature sensor allocation strategy and full thermal reconstruction for microprocessors

Temperature Distribution Evaluation of Single Chip by Multiple Currents V CE (T) Method

Thermal Full-Field Prediction of an Air-Cooled Data Center Using a Novel Multi-Scale Approach Based on POD and CFD Coupling

Deep Learning for Real-Time Chip Temperature and Power Predictions

Data-Driven Real-Time Prediction of Pouch Cell Temperature Field Under Minimal Sensing

Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors

Thermal-aware Resource Usage Allocation