Abstract:To achieve high-performance thermoelectric (TE) devices, constructing a good interfacial connection between TE materials and electrodes is as important as having high figure-of-merit TE materials. Although CoSb3-based TE devices have received great attention for power generation recently, the limited long-term service stability is the main obstruct for their applications. In this work, we have prepared two kinds of Ti-based alloys (Ti83.7Al10.7Si5.6 and Ti74Ni26) as the diffusion barrier layer of CoSb3-based TE joints by the spark plasma sintering method and have systematically investigated their interfacial behaviors during the aging process. The performances of contact resistivity and mechanical strength for Ti74Ni26/Yb0.4Co3.8Fe0.2Sb12 TE joints are good before aging treatment but gradually deteriorate during the aging process, which should be ascribed to the phase-transition-induced negative thermal expansion in Ti-Ni alloys. On the other hand, Ti83.7Al10.7Si5.6/Yb0.4Co3.8Fe0.2Sb12 TE joints show both low contact resistivity (<10 μΩ·cm2) and high mechanical strength (>20 MPa) before and after 16-day aging at 500 °C, which is originated from the matching of the coefficient of thermal expansion (CTE) and the formation of network structures in Ti-Al-Si alloys. We have also prepared an eight-couple TE module of p-Ge0.9Sb0.1TeB0.01/n-Yb0.4Co3.8Fe0.2Sb12 and have measured its corresponding device performance. Our work has demonstrated that the matched CTE and network structures in the Ti-Al-Si alloy are key to obtain high-performance CoSb3-based TE joints for long-term service.

Research on the Thermal Stability of MoCu/CoSb3 Thermoelectric Junction with CoCrFeNi High-Entropy Alloy Barrier Layer

Achieving Reliable CoSb3 based thermoelectric joints with low contact resistivity using a high-entropy alloy diffusion barrier layer

Enhanced Interfacial Reliability and Mechanical Strength of CoSb3-Based Thermoelectric Joints with Rationally Designed Diffusion Barrier Materials of Ti-Based Alloys

Enhancing Interfacial Stability and Mechanical Strength of a CoSb3-Based Thermoelectric Junction Using Ti-Based Alloy Barrier Layers.

Interfacial Reactions at the Joints of Cosb3-Based Thermoelectric Devices

Metallization and Diffusion Bonding of CoSb3-Based Thermoelectric Materials

Mo-Fe/NbFeSb Thermoelectric Junctions: Anti-Thermal Aging Interface and Low Contact Resistivity

Thermal Stability Optimization of Single-Leg Skutterudite-Based Thermoelectric Devices Based on Lattice Distortion Effects

Interface Structure and Electrical Property of Yb0.3co4sb12/Mo-Cu Element Prepared by Welding Using Ag-Cu-Zn Solder

Low interfacial resistivity in CoSi<sub> 2</sub>/ZrCoSb thermoelectric junctions

Interfacial Stability in Bi2Te3 Thermoelectric Joints

Interface Characterization of Cu–Mo Coating Deposited on Ti–Al Alloys by Arc Spraying

Low Contact Resistivity and Long-Term Thermal Stability of Nb0.8Ti0.2FeSb/Ti Thermoelectric Junction

Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi 2 Te 3 Thermoelectric Material

Enhanced Thermoelectric Properties and Electrical Stability for Cu 1.8 S-based Alloys: Entropy Engineering and Cu Vacancy Engineering

Low Contact Resistivity and Interfacial Behavior of P-Type NbFeSb/Mo Thermoelectric Junction.

Study on the Preparation and Properties of a Co-Based Barrier Layer by Diffusion Welding

The Thermal and Electrical Properties of CoMo Alloys As Copper Adhesion/barrier Layers

Al-Si Alloy as a Diffusion Barrier for GeTe-Based Thermoelectric Legs with High Interfacial Reliability and Mechanical Strength

Microstructure Evolution and Mechanical Properties of SiC/Mo Joint Brazed with FeCoCrNi High-Entropy Alloy Filler

Microstructural evolution and failure mechanism dominated by Bi, Sb cooperative diffusion at p-type thermoelectric pillar Bi-Sb-Te/Sn interface