Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Yu-An Shen,Chun-Ming Lin,Jiahui Li,Siliang He,Hiroshi Nishikawa
DOI: https://doi.org/10.1038/s41598-020-67126-y
IF: 4.6
2020-07-22
Scientific Reports
Abstract:An amendment to this paper has been published and can be accessed via a link at the top of the paper.
multidisciplinary sciences
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