Co-enhancement of Thermal Conduction and Radiation Through Morphologies Controlling of Graphene Functional Layer for Chip Thermal Management
Shuting Cheng,Kun Wang,Shichen Xu,Yi Cheng,Ruojuan Liu,Kewen Huang,Hao Yuan,Wenjuan Li,Yuyao Yang,Fushun Liang,Fan Yang,Kangyi Zheng,Zhiwei Liang,Ce Tu,Mengxiong Liu,Xiaomin Yang,Jingnan Wang,Xuzhao Gai,Yuejie Zhao,Xiaobai Wang,Yue Qi,Zhongfan Liu
DOI: https://doi.org/10.1007/s12274-024-6540-6
IF: 9.9
2024-01-01
Nano Research
Abstract:With the continuous advancements in electronics towards downsizing and integration, efficient thermal dissipation from chips has emerged as a critical factor affecting their lifespan and operational efficiency. The fan-less chip cooling system has two critical interfaces for thermal transport, which are the contact interface between the base and the chip dominated by thermal conduction, and the surface of the fins dominated by thermal radiation. The different thermal transfer modes of these two critical interfaces pose different requirements for thermal management materials. In the study, a novel approach was proposed by developing graphene thermal transport functional material whose morphology could be intentionally designed via reformed plasma-enhanced chemical vapor deposition (PECVD) methods to meet the diverse requirements of heat transfer properties. Specifically, graphene with multilevel branching structure of vertical graphene (BVG) was fabricated through the hydrogen-assisted PECVD (H2-PECVD) strategy, which contributed a high emissivity of ∼ 0.98. BVG was deposited on the fins’ surface and functioned as the radiation enhanced layer to facilitate the rapid radiation of heat from the heat sinks into the surrounding air. Meanwhile, the well-oriented vertical graphene (OVG) was successfully prepared through the vertical electric field-assisted PECVD process (EF-PECVD), which showed a high directional thermal conductivity of ∼ 53.5 W·m−1·K−1. OVG was deposited on the contact interface and functioned as the thermal conduction enhanced layer, allowing for the quick transmission of heat from the chip to the heat sink. Utilizing this design concept, the two critical interfaces in the chip cooling system can be jointly enhanced, resulting in a remarkable cooling efficiency enhancement of ∼ 30.7