Performance of heat sink using graphene nanoplatelets-H2O nanofluids for electronic cooling applications

Vinoth Nagarajan,Siddharth Mittal,Selvam Chandrasekaran
DOI: https://doi.org/10.1080/15567036.2024.2434730
2024-12-04
Energy Sources Part A Recovery Utilization and Environmental Effects
Abstract:This study proposes a novel solution for enhancement of the performance of electronic chips using a liquid channel heat sink with graphene nanoplatelets (GnP) dispersed in deionized (DI) water (H 2 O). The nanofluid was prepared using a two-step method with variations made in the vol% of GnP from 0.01% to 0.1%, with the addition of sodium deoxycholate (0.75 vol%) added as surfactant. The prepared nanofluids remained stable for two weeks without any sedimentation. The thermo-physical properties at the required temperature have been measured and reported in previously published literature. The nanofluid was passed along the microchannels of the heat sink, and its heat transfer performance was experimentally studied. The heat input to the bottom surface of the heat sink was varied from 60 W to 100 W in increments of 10 W while the variation in the nanofluid mass flow rate was from 0.6 to 2.2 mL/s. The results indicated a 66% decrease in the heat sink base temperature with 0.1 vol% of GnP/H 2 O nanofluid compared to H 2 O. The maximum decrease in thermal resistance observed was 58%. The convective heat transfer coefficient was enhanced by 23% higher at 0.1 vol% of GnP/H 2 O nanofluid compared to H 2 O.
energy & fuels,engineering, chemical
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