Heat transfer enhancement and flow resistance reduction characteristics of non-uniform electrohydrodynamic conduction pumping in microchannels
Xilong Zhang,Jiang Liu,Bin Liu,Peng Cang,Zhicheng Zhou
DOI: https://doi.org/10.1016/j.applthermaleng.2024.124721
IF: 6.4
2024-10-28
Applied Thermal Engineering
Abstract:In this study, the thermo-hydraulic performance of non-uniform electrohydrodynamic (EHD) conduction pumping in rectangular and straight microchannels was experimentally investigated. Electrodes are arranged in two ways: dimensions constant, spacing varies (Cases 1–3); both dimensions and spacing vary (Cases 4–6). The results show that EHD conduction pumping significantly enhances heat transfer performance, increasing the average Nusselt number (Nu) by 17.9 %-87 % compared to a smooth microchannel. As Re increases, the inertial force of the fluid dominates, diminishing EHD-induced vortices and limiting heat transfer enhancement. EHD conduction pumping enhances heat transfer by creating vortices that mimic solid pseudo-roughness microelements, increasing fluid disturbance and mixing near the wall. However, these vortices also impede the flow, resulting in a trade-off with increased pressure drop resistance. This paper innovatively adopts an arrangement of increasing electrode size (non-uniform), which effectively reduces the pressure drop resistance in the microchannel while maintaining the advantage of enhanced heat transfer. Cases 4, 5, and 6 exhibit significantly higher comprehensive heat transfer performance (η) than Case 0 (without electrodes), especially at low Re. While the inertial force at high Re suppresses vortex formation and heat transfer enhancement, η remains superior to Case 0. Notably, Case 5 maintains a minimum η of 1.18 even at Re = 1000. Furthermore, this paper proposes an equivalent slip drag reduction mechanism to elucidate the drag reduction effect of the increasing electrode size arrangement. Heat transfer augmentation and pressure drop reduction, as mentioned here in microchannels, are crucial for electronics cooling and microfluidic devices.
energy & fuels,engineering, mechanical,thermodynamics,mechanics