Abstract:Three-dimensional (3D) interconnect technology promises significant performance advantages for the next generation of high speed and multi-functional electronic devices, however, the large-scale integration of electronic circuit and vertical stacking of multi-functional dice have been demonstrated to result in substantially increased waste-heat generation rates and localized hotspots. Efficient thermal management solutions are imperative to ensure the operating temperature of components below a reasonable level. Among various cooling techniques, metal foam heat sink has been identified as a promising alternative for electronic cooling, because of the large specific surface area, high effective thermal conductivity and intensive fluid mixing capability that foam material provided. In this study, a novel micro-channel heat sink with combined metal foam-solid fin, namely combined fin heat sink (CFHS), was established for electronics cooling. Numerical simulations based on Brinkman-Darcy extended momentum equation and local thermal non-equilibrium energy equations were carried out to investigate the fluid flow and heat transfer characteristics. To simplify the computations, a single channel was used as the computational domain with a dimension of 20 mmx2.4 mmx6 mm. The constant heat flux of 100 W/cm(2) was supplied at the bottom wall to simulate the high-powered electronic device. Metal foam and fin were made of high thermal conductivity copper, and pure water was used as the working coolant. It was assumed that the metal foam was fully saturated with fluid in laminar flow state and the thermal resistance between the metal foam and fin was neglected. Effects of combined fin configuration on the flow and heat transfer performances were studied to determine the optimal porosity and dimensionless metal foam layer thickness for designing the CFHS. The thermal performance of the novel heat sink was compared to that of the conventional heat sink, and the total thermal resistance was analyzed based on the simplified thermal resistance network. The results indicate that the CFHS is more favorable in promoting thermal performance that the average Nusselt number of CFHS is 2.53 times higher than that of the conventional heat sink, while accompanied by the high pressure drop as a penalty. The flow resistance and specific area are two conflicting parameters that affect the thermal and hydraulic performances of the CFHS, our results show that there exists a critical dimensionless metal foam thickness and optimal porosity, which are 0.9 and 0.3, respectively. Compared with the conventional heat sink, the total thermal resistance of CFHS is significantly reduced by 56%, and the thermal performance factor of CFHS performs 1.32 times higher. The presented CFHS thus provides a feasible solution for thermal management of electronic devices with high-powered density.

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