Diffusion bonding of a Cu–Cr–Zr alloy to stainless steel and tungsten using nickel as an interlayer

I.S. Batra,G.B. Kale,T.K. Saha,A.K. Ray,J. Derose,J. Krishnan
DOI: https://doi.org/10.1016/j.msea.2003.10.296
2004-03-01
Abstract:In the present work, diffusion bonding of Cu-1wt.% Cr-0.1wt.% Zr alloy to tungsten as well as to stainless steel 316 (SS) has been attempted using nickel as an interlayer. This could be achieved in a single step and the bonds were found to be metallurgically sound with the strength exceeding that of the sintered tungsten used in this work.
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