Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films

Two softening stages in nanotwinned Cu

Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing

Effect of Thermal Stress on Anisotropic Grain Growth in Nano-Twinned and Un-Twinned Copper Films

Kinetics and Energetics of Room-Temperature Microstructure in Nanocrystalline Cu Films: the Grain-Size Dependent Intragrain Strain Energy

Experiment and Simulation of Grain Growth in a Bidimensional Polycrystalline Film

Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

Abnormal Grain Growth in Thin Copper Foils During High-Temperature Annealing

3D Characterization of Abnormal Grain Growth in Nanocrystalline Nickel

Thermal Stability of Nanocrystalline Grains in Cu-W Films

Deformation induced columnar grain rotation in nanotwinned metals

Lattice Distortion and Thermal Stability of Nano-Crystalline Copper

Abnormal grain growth of (110)-oriented perpendicular nanotwinned copper into ultra-large grains at low temperatures

Investigation of Abnormal Grain Growth Andtexture Change in Ag and Cu Films

Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper

Stabilizing defective coherent twin boundaries for strong and stable nanocrystalline nanotwinned Cu

Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper

Microstrain effect on thermal properties of nanocrystalline Cu

Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate

Investigation of microstructure thermal evolution in nanocrystalline Cu