Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

Effect of Thermal Stress on Anisotropic Grain Growth in Nano-Twinned and Un-Twinned Copper Films

Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing

Effect of Stress-Dependent Thermal Conductivity on Thermo-Mechanical Coupling Behavior in GaN-Based Nanofilm under Pulse Heat Source

MP-16 the Effect of Cooling Process on Copper Oxide Nanowires Generated by Stress-Induced Method

Surface Stress Effects On The Yield Strength In Nanotwinned Polycrystal Face-Centered-Cubic Metallic Nanowires

Two softening stages in nanotwinned Cu

Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films

Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure

Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper

Growth Of Metal And Metal Oxide Nanowires Driven By The Stress-Induced Migration

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

Stress-Induced Growth of Well-Aligned Cu2o Nanowire Arrays and Their Photovoltaic Effect

Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints

Effect of De-Twinning on Tensile Strength of Nano-Twinned Cu Films

The Effect of Stress Gradient on the Formation of TCP Phases in a Ni-based Single Crystal Superalloy at 1050 Oc

Control of the Diameters of Cu2o Nanowires Fabricated by the Thermal Stress-Induced Method

Influence of thermal annealing on the microstructure evolution, fracture and fatigue behavior of nanocrystalline Cu films

A Constitutive Description of the Yield Strength and Strain Hardening Behaviors of Nano-Twinned Metals

Thermal Stability of Grain Structure for Ag Nanotwinned Films Sputtered With Substrate Bias

The Anomalous Temperature Effect on the Ductility of Nanocrystalline Cu Films Adhered to Flexible Substrates

Molecular dynamics simulation on mechanisms of plastic anisotropy in nanotwinned polycrystalline copper with {111} texture during tensile deformation