Scaled Atomic-Layer-Deposited Indium Oxide Nanometer Transistors With Maximum Drain Current Exceeding 2 A/mm at Drain Voltage of 0.7 V

Mengwei Si,Zehao Lin,Adam Charnas,Peide D. Ye
DOI: https://doi.org/10.1109/led.2020.3043430
IF: 4.8157
2021-02-01
IEEE Electron Device Letters
Abstract:In this work, we demonstrate scaled back-end-of-line (BEOL) compatible indium oxide (In<sub>2</sub>O<sub>3</sub>) transistors by atomic layer deposition (ALD) with channel thickness (T<sub>ch</sub>) of 1.0-1.5 nm, channel length (L<sub>ch</sub>) down to 40 nm, and equivalent oxide thickness (EOT) of 2.1 nm, with record high drain current of 2.0 A/mm at V<sub>DS</sub> of 0.7 V among all oxide semiconductors. Enhancement-mode In<sub>2</sub>O<sub>3</sub> transistors with I<sub>D</sub> over 1.0 A/mm at V<sub>DS</sub> of 1 V are also achieved by controlling the channel thickness down to 1.0 nm at atomic layer scale. Such high current density in a relatively low mobility amorphous oxide semiconductor is understood by the formation of high density 2D channel beyond $4times 10^{13}$ /cm<sup>2</sup> at HfO<sub>2</sub>/In<sub>2</sub>O<sub>3</sub> oxide/oxide interface.
engineering, electrical & electronic
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