Abstract:Cold Expansion (CE) techniques are extensively used in the aeronautical industry to enhance the fatigue life of open-hole plates. However, the availability of accurate Finite Element (FE) models to simulate the fatigue behavior of this process, particularly Dynamic Cold Expansion (DCE), is limited. This study introduces two novel methods for predicting the fatigue response of DCE and Static Cold Expansion (SCE) open-hole plates. The first method directly estimates the total fatigue life using Continuum Damage Mechanics (CDM) and the Theory of Critical Distance (TCD). The second method separates the prediction of fatigue crack initiation life and propagation life, incorporating CDM, TCD, and the Extended Finite Element Method (XFEM). Moreover, FE models are developed to simulate residual stress, stress under external cyclic loads , and fatigue crack propagation behavior for both DCE and SCE specimens. The proposed methods are evaluated, compared, and the mechanisms behind fatigue life enhancement and fatigue crack propagation modes in CE specimens are discussed. It is found that the prediction accuracy is enhanced by considering stress distributions along the thickness direction and improving the Line Method (LM) in TCD through the introduction of a novel CE parameter. The results demonstrate that both methods achieve good predictive performance , with an average error index within ±30%. Furthermore, it is observed that both DCE and SCE processes primarily improve the fatigue crack initiation life of open-hole plates, with the percentage of crack initiation fatigue life increasing as the expansion size increases. The majority of the fatigue crack propagation life in CE specimens is concentrated in the initial stages of crack propagation. In addition, the effects of DCE and SCE processes on reducing the fatigue crack propagation rate are more pronounced along the thickness direction compared to the width direction, leading to distinct crack propagation modes between CE and non-cold expansion (NCE) specimens.

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