A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging
Jintao Wang,Xinjie Wang,Lin Zhang,Luobin Zhang,Fangcheng Duan,Fengyi Wang,Weiwei Zhang,Jianqiang Wang,Zheng Zhang,Chunjin Hang,Hongtao Chen
DOI: https://doi.org/10.3390/ma15030914
IF: 3.4
2022-01-25
Materials
Abstract:A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this soldering material had a shear strength of over 40 MPa at 25 °C. This joint did not fail after more than 600 thermal cycles from −40 °C to 140 °C. The special feature of this joint is that the energy potential difference between nanoparticles and micron particles generated in the surface force field during reflow promoted the surface pre-melting of the particles by releasing the excess energy. By this mechanism, it was possible to reduce the porosity of the sintered layer. At the same time, due to the high surface activity energy of nano-silver, the diffusion of the Sn atoms was promoted, further enhancing the bond strength.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering