Fabrication of BiScO3–PbTiO3/epoxy 1–3 piezoelectric composites for high‐temperature transducer applications

Liqing Hu,Ruoqi Jin,Chenyu Qiu,Xiaodan Ren,Sanhong Wang,Zhuo Xu,Hua Tian,Xiaotian Li,Yongke Yan
DOI: https://doi.org/10.1111/jace.20139
IF: 4.186
2024-09-20
Journal of the American Ceramic Society
Abstract:1–3 piezoelectric composites are widely used in piezoelectric ultrasonic transducers due to their high thickness electromechanical coupling factor. However, the applications of the composites in high‐temperature fields are limited by the low heat resistance of both the piezoelectric and polymer phases. To tackle this, we designed and fabricated the BiScO3–PbTiO3/epoxy high‐temperature 1–3 piezoelectric composites. These composites exhibit a high thickness electromechanical coupling factor kt of 63%, a large piezoelectric coefficient d33 of 470 pC/N, and a pure thickness vibration mode. Furthermore, we fabricated a high‐temperature transducer based on the BiScO3–PbTiO3/epoxy 1–3 composites. The bandwidths of the composites measured in water and silicone oil (30% and 23%, respectively) are approximately 1.65 times greater than those of monolithic piezoelectric ceramics (18% and 14%, respectively). The bandwidth of the transducer can be increased to 78% by adding a porous alumina backing layer, with the working temperature reaching up to 300°C. The results indicate that the BS–PT/epoxy 1–3 composite is a potential candidate for high‐temperature transducer applications.
materials science, ceramics
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