3.4-kV AlGaN/GaN Schottky Barrier Diode on Silicon Substrate With Engineered Anode Structure
Ru Xu,Peng Chen,Menghan Liu,Jing Zhou,Yimeng Li,Kai Cheng,Bin Liu,Dunjun Chen,Zili Xie,Rong Zhang,Youdou Zheng
DOI: https://doi.org/10.1109/led.2020.3049086
IF: 4.8157
2021-02-01
IEEE Electron Device Letters
Abstract:In this letter, we demonstrate high-performance lateral AlGaN/GaN Schottky barrier diodes (SBD) on Si substrate with a recessed-anode structure. The optimized rapid etch process provides results in improving etching quality with a ~ 0.3 nm roughness of the ${5}times {5},,mu text{m}^{{{2}}}$ anode recessed surface. Supported by the flat anode recess surface and optimized anode field plate design. When the anode-to-cathode spacing is 30 $mu text{m}$ , the physical breakdown voltage ( ${V}_{textit {BK}}{)}$ can reach 3.4 kV, with a specific on-resistance ( ${R}_{textit {on},textit {sp}}{)}$ of 3.7 $text{m}Omega cdot $ cm<sup>2</sup>, the power figure of merit ( ${V}_{textit {BK}}^{{2}}/{R}_{textit {on},textit {sp}}{)}$ can be as high as 3.1 GW/cm<sup>2</sup>, demonstrating its great potential for the application in power electronics.
engineering, electrical & electronic