2.7-Kv Algan/Gan Schottky Barrier Diode On Silicon Substrate With Recessed-Anode Structure

Ru Xu,Peng Chen,Menghan Liu,Jing Zhou,Yimeng Li,Bin Liu,Dunjun Chen,Zili Xie,Rong Zhang,Youdou Zheng
DOI: https://doi.org/10.1016/j.sse.2020.107953
IF: 1.916
2021-01-01
Solid-State Electronics
Abstract:In this paper, we demonstrate high-performance lateral AlGaN/GaN Schottky barrier diodes (SBD) on Si substrate with a recessed-anode structure. The optimized rapid etch process provides results in improving etching quality with a 0.26-nm roughness of the anode recessed surface. By using the high work function metal Pt as the Schottky electrode, a low turn-on voltage of 0.71 V is obtained with a high uniformity of +/- 0.023 V for 40 devices. Supported by the flat anode recess surface and related field plate design, the SBD device with the anode-cathode spacing of 15 mu m show the specific on-resistance (R-on,R-sp) of 1.53 m omega.cm(2) only, the physical breakdown voltage can reach 1678 V with a high power figure-of-merit (P-FOM) of 1840 MW/cm(2). For the SBD device with the anode-cathode spacing of 30 mu m, the physical breakdown voltage can be as high as 2705 V and the power FOM is 2217 MW/cm(2).
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