Effect of Stoichiometry on Resistive Switching Characteristics of STO Resistive Memory

Chih-Chieh Hsu,Chao-Wen Cheng,Xiu-Ming Wen,Mojtaba Joodaki
DOI: https://doi.org/10.1039/d3tc01847d
IF: 6.4
2023-07-07
Journal of Materials Chemistry C
Abstract:In this article, SrTiO 3 (STO) resistive memories with write-once-read-many-times (WORM) function are fabricated. The STO resistive switching (RS) layers are deposited at sputtering powers of 40-120 W and oxygen flow rates of 0-3 sccm. Without oxygen addition, the deposited STO films are nonstoichiometric, and the Sr/Ti ratios are all higher than unity. The ON/OFF current ratio of the STO memory deposited at 40 W is 10 6 . When the power increases from 40 W to 120 W, a decrease of Sr/Ti ratio is obtained. The stoichiometry of the STO film is closer to unity. Meanwhile, the memory shows a higher ON/OFF current ratio of 5 x 10 6 . Oxygen is further introduced during the sputtering process to adjust the STO stoichiometry. The Sr/Ti ratio can decrease from 1.54 to 1.04 when the STO is deposited at an oxygen flow rate of 1 sccm. The stoichiometric STO RS layer results in a significantly higher ON/OFF current ratio of 2 x 10 8 . The STO film becomes nonstoichiometric, where the Sr/Ti ratio is lower than unity, when the oxygen flow rate further increases to 3 sccm. Data storage capability of the STO memory is investigated. Moreover, stability tests at 85 °C are performed to study the device lifetime. Temperature-dependent measurement is employed to verify the validity of filamentary mechanism. Carrier conduction mechanism and energy band diagram are also studied and illustrated.
materials science, multidisciplinary,physics, applied
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