Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads
Supriyono,Tzu-Chia Chen,Lis M. Yapanto,Zagir Azgarovich Latipov,Angelina Olegovna Zekiy,Lyubov A. Melnikova,Lakshmi Thangavelu,A. Surendar,Nikolay I. Repnikov,Zeinab Arzehgar
DOI: https://doi.org/10.1108/ssmt-04-2021-0014
2021-07-30
Abstract:Purpose In this paper, a lifetime estimation model for the solder joint is proposed which is capable of considering both severe and running mechanical shocks which is the real case in electric converters in the automotive and aerospace applications. This paper aims to asses the reliability of the solder joint under mixed exposure of mechanical loads. Design/methodology/approach Mechanical failure process may put at risk the perfect performance of any kinds of electronic systems regardless of the applications they are prepared for. Observation of solder joint health in an electronic assembly under simultaneous exposure of severe and running shocks is an open problem. Three commonly used soldering compositions are considered while the electronic assembly is exposed to three well-known driving cycles. Findings The results show that the best performance is achieved using SAC405 soldering alloy in comparison with Sn63Pb37 and SAC387 solder alloy. Consideration of mixed exposure to the mechanical loads leads to much more accurate lifetime estimation of the solder joint in the electronic assemblies. Originality/value The originality of the paper is confirmed.
materials science, multidisciplinary,engineering, electrical & electronic,metallurgy & metallurgical engineering, manufacturing