Theoretical and experimental analysis for the surface shape evolution of ultrathin workpiece considering the pad surface shape in double-sided polishing

Lei Yang,Xiaoguang Guo,Renke Kang,Xianglong Zhu,Zijun Zhu,Yufan Jia
DOI: https://doi.org/10.1016/j.mssp.2023.107917
IF: 4.1
2024-01-01
Materials Science in Semiconductor Processing
Abstract:Good surface shape in double-sided polishing for ultrathin workpieces is always difficult to predict due to the complex dynamic contact conditions caused by the pad surface shape, which has often been neglected in previous studies. In this study, based on the Preston equation, a semi-empirical model of workpiece surface evolution considering the pad surface shape was developed. The elastic deformation of the workpiece is calculated based on the elastic mechanics and the finite element method. Furthermore, the winkle elastic foundations model is used to calculate the contact pressure on the workpiece after taking into account the elastic deformation of the ultra-thin workpiece and pad surface shape. Then, the workpiece surface shape and peak-to-valley value are simulated under different parameters. Several sets of experiments were used to determine the Preston coefficient distribution in the model as well as verify the validity of the model. The results show the experiment has good consistency with the simulation, and the maximum error of the model is less than 14. 2 %. This result verifies the correctness and validity of the established model. The polishing process parameters were optimized for better flatness. This work can provide theoretical support for predicting and controlling the flatness of ultrathin workpieces in semiconductor and laser fields.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
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