Abstract:The effect of copper content on the passivity of Ti–xCu alloys in a phosphate-buffered saline electrolyte (pH 7.4), in the steady-state condition, was examined using potentiostatic polarization, electrochemical impedance spectroscopy, and Mott-Schottky analysis. The study demonstrates that the oxide layer forms on the Ti–xCu alloys surface have n-type semiconducting character, and the steady-state thickness of the oxide layer is observed linearly and depends on the applied potential. The study observations are in line with the predictions of the Point Defect Model (PDM-II), which provides a physiochemically realistic description of the oxide layer formation on Ti–xCu alloys. The observations reveal that the Cu additions result in a decrease in the charge transfer resistance and capacitances associated with the hydroxide and barrier layer, an increase in the donor density, and reduce the electrochemical resistance of the Ti–xCu alloys. The study also exhibits that the decrease in the steady-state current density after the initial addition of 3 wt% of Cu is attributed to the progressive substitution of copper on the cation sublattice of the film resulting in enhanced electrostatic interaction between the immobilized copper Cu Ti x ′ , and the mobile cation interstitials Cu i + , which carries the excess current over and that conveyed by oxygen vacancies V o • • in the barrier layer. Moreover, it is also observed that over a hundred-year implant period, about 0.006 cm (0.06 mm) of Ti–3Cu alloy is predicted to lose due to steady-state corrosion in the PBS solution under the given set of conditions, it is further seen that, as the Cu amount increased from 3 wt% to 5 wt% in the Ti–xCu alloys, the steady-state corrosion rate decreases.

Study the existing form of copper (p-type oxide/segregation) and its release mechanism from the passive film of Ti-7Cu alloy

P-type Transparent Conducting Copper Aluminum Oxide Films with Different Cu/Al Ratio

Effect of Cu on the passivity of Ti–xCu (x = 0, 3 and 5 wt%) alloy in phosphate-buffered saline solution within the framework of PDM-II

The semi-conductor property and corrosion resistance of passive film on electroplated Ni and Cu-Ni alloys

Electronic Properties of the Passive Films Growth on Cu-Ni Alloy from the Viewpoint of Point Defect Model and Power-Law Model

Theoretical Explanation of Passivation Behavior in OFP-Cu and OF-Cu

Defect Reactions In Copper-Diffused And Quenched P-Type Silicon

Copper migration and surface oxidation of $\text{Cu}_{x}\text{Bi}_2\text{Se}_3$ in ambient pressure environments

Cu ions release and the formation of CuO/Cu 2 O during PEO based on the work function

Structural, Electrical and Corrosion Properties of Bulk Ti–Cu Alloys Produced by Mechanical Alloying and Powder Metallurgy

Oxidation failure and mechanism of lead frame copper alloys for IC package

An investigation into copper oxidation behavior

Evaluation of the thermal stability of TiW/Cu heterojunctions using a combined SXPS and HAXPES approach

(Digital Presentation) Anti-Corrosion Investigation of Titanium Electrode for Cu Plating

The wear and microstructural characterization of copper surface coated with TiC reinforced FeAl intermetallic composite by ESD method

Oxidation failure mechanism of copper alloy lead frame for IC package

Study on the corrosion behavior of copper coupled with TiO2 with different crystal structures

Oxidation Failure Of Lead Frame Copper Alloys With-Surface Electroplated Pure Cu

In-situ temperature-dependent sheet resistance study of Cu films in oxygen ambient for heterogeneous integrations

Theoretical study on copper's energetics and magnetism in TiO2 polymorphs

Fabrication of P-Type Copper Oxide Thin-Film Transisters at Different Oxygen Partial Pressure