Abstract:For the integration of a reactive multilayer system (iRMS) with a high exothermic reaction enthalpy as a heat source on silicon wafers for low-temperature bonding in the 3D integration and packaging of microsystems, two main conflicting issues should be overcome: heat accumulation arising from the layer interface pre-intermixing, which causes spontaneous self-ignition during the deposition of the system layers, and conductive heat loss through the substrate, which leads to reaction propagation quenching. In this work, using electron beam evaporation, we investigated the growth of a high exothermic metallic Pd/Al reactive multilayer system (RMS) on different Si-wafer substrates with different thermal conduction, specifically a bare Si-wafer, a RuOx or PdOx layer buffering Si-wafer, and a SiO2-coated Si-wafer. With the exception of the bare silicon wafer, the RMS grown on all other coated wafers underwent systematic spontaneous self-ignition surging during the deposition process once it reached a thickness of around 1 μm. This issue was surmounted by investigating a solution based on tuning the output energy by stacking alternating sections of metallic reactive multilayer Pd/Al and Ni/Al systems that have a high and medium enthalpy of exothermic reactions, respectively. This heterostructure with a bilayer thickness of 100 nm was successfully grown on a SiO2-coated Si-wafer to a total thickness of 3 μm without any spontaneous upsurge of self-ignition; it could be electrically ignited at room temperature, enabling a self-sustained propagating exothermic reaction along the reactive patterned track without undergoing quenching. The results of this study will promote the growth of reactive multilayer systems by electron beam evaporation processing and their potential integration as local heat sources on Si-wafer substrates for bonding applications in microelectronics and microsystems technology.

Electroplating of Palladium‐based integrated Reactive Multilayer Systems (iRMS)

Development of Palladium Separation Process from Nitric Acid Medium Utilizing a New Hybrid Multi-Nitrogen Adsorbent

Investigation of Integrated Reactive Multilayer Systems for Bonding in Microsystem Technology

Targeting new ways for large-scale, high-speed surface functionalization using Direct Laser Interference Patterning in a roll-to-roll process

Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper

Modification of Polymeric Surfaces with Ultrashort Laser Pulses for the Selective Deposition of Homogeneous Metallic Conductive Layers

Laser Direct Activation of Polyimide for Selective Electroless Plating of Flexible Conductive Patterns

Photoselective Deposition of Copper Lines on ABS Substrates by Electroless Plating

Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish

Electroless Nimop Thin Film Deposition On Si/Sio2

Introduction of a Chemical-Free Metal PDMS Thermal Bonding for Fabrication of Flexible Electrode by Metal Transfer onto PDMS

Formation and Characterization of Dendritic Interfacial Electrodes inside an Ionomer.

Selective‐area electroless copper plating on polyimide employing laser patterning of a catalytic film

Interlayer Design for Strong Adhesion in the Double-Layer Flexible Copper Clad Laminate Via Hipims Deposition

High Speed Copper Plating Process for IC Substrate

Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level

Study on the adhesion and reliability of Epoxy Molding Compound and shaped Pd Preplated leadframes

Hierarchical Structures on Platinum–iridium Substrates Enhancing Conducting Polymer Adhesion

Development of hybrid bonding using area-selective passivation layer deposition technology on various substrates for heterogeneous integrated structure

Adhesion-Enhanced Flexible Conductive Metal Patterns on Polyimide Substrate Through Direct Writing Catalysts with Novel Surface-Modification Electroless Deposition

Preparation of Ion-Exchange Resin Via In-Situ Polymerization for Highly Selective Separation and Continuous Removal of Palladium from Electroplating Wastewater