Microstructure and Properties of Tungsten-40 Wt.-% Copper Composites Fabricated by Binder Jet 3D Printing
Y. F. Tian,J. Sun,Z. Q. Xu,X. Q. Meng,Z. Chen,J. Y. Tang,P. Tao,L. M. Luo,Y. C. Wu
DOI: https://doi.org/10.1002/mawe.202300112
2024-01-01
Materialwissenschaft und Werkstofftechnik
Abstract:In this work, the tungsten-copper composites were fabricated by binder jet 3D printing technology. The effects of different printing layer thicknesses (50 mu m to 100 mu m) on the green density and green strength were investigated. Then, under the optimal layer thickness, the effects of different sintering temperatures (1300 degrees C to 1600 degrees C) on the microstructure and densification of tungsten-40 wt.-% copper composites were studied. The experimental results showed that when the printing layer thickness was set as a lower value (50 mu m), the tungsten-40 wt.-% copper green part had the best strength and its density reached a maximum value of 60.73 %. After sintering for green parts printed with 50 mu m layer thickness, the relative density, thermal conductivity and electrical conductivity of sintered parts first increased and then decreased with increasing sintering temperature. In our experiments, the tungsten-40 wt.-% copper sample fabricated by binder jet 3D printing with a printing layer thickness of 50 mu m under a sintering temperature of 1500 degrees C displayed the best properties, in which the relative density, thermal conductivity and electrical conductivity were 97.04 %, 228 W & sdot;m-1 & sdot;K-1 and 46.5 % IACS, respectively. In this work, tungsten-copper composites were prepared by binder jet 3D printing technology for the first time. By studying the effects of printing layer thickness and sintering temperature on density and properties, a tungsten-40 wt.-% copper composite with a relative density of up to 97.04 % and a thermal conductivity of 228 W & sdot;m-1 & sdot;K-1 was successfully prepared. image