Influence of thermal exposure on the microstructure evolution and mechanical behaviors of an Al-Cu-Li alloy

Mingdong Wu,Wensheng Liu,Daihong Xiao,Lanping Huang

DOI: https://doi.org/10.1016/j.matdes.2023.111767

2023-02-19

Abstract:In this study, the T85-treated Al-3.78Cu-1.17Li-0.7Mg-0.32Ag-0.25Mn-0.33Zn-0.12Zr alloy thermally exposed at a series of temperatures (100–300 °C) for 100 h, 500 h, and 1000 h was systematically investigated. The results show that the thermal stability of the alloy is more closely correlated with thermal exposure temperature than with exposure duration. Excellent thermal stability in strength is obtained below 150 °C, which can be linked to the diameter and number density of T1 (Al 2 CuLi) precipitates continually increasing with a thickness less than 2 nm. However, the widened precipitation-free zones (PFZs) associated with continuous grain boundary precipitates (GBPs) benefit intergranular fracture, contributing to a decrease in toughness and elongation. In the window of 175–200 °C, T1 precipitates tend to thicken and are gradually substituted by coarse θ'-Al 2 Cu and S-Al 2 CuMg with elevating temperature. Simultaneously, the continuous GBPs transverse to discrete circle-like shapes, and thus intergranular ductile fracture becomes dominant. Therefore, the related hardness and strength decrease, while the electrical conductivity and toughness are the opposite. At temperatures over 250 °C, thermal exposure can reduce the dislocation density and dissolve T1 phases to form T2-Al 6 Cu(Li, Mg) 3 and cubic C phases, leading to a dramatic decrease in strength and toughness.

materials science, multidisciplinary