Recent Developments in Copper Plating

D. E. Weimer
DOI: https://doi.org/10.1080/00202967.1957.11869744
1957-01-01
Transactions of the IMF
Abstract:The application and deposit characteristics of copper which are required in decorative electroplating are discussed. Research and development in copper plating has been mainly concerned in improving deposit characteristics from well established electrolytes and recent work is cited in support of this. However there is little evidence to show that the inherent problems of cyanide copper and acid sulphate copper electrodeposition have been overcome. Research has also been directed towards the development of other elctrolytes for copper deposition and in this connection the author gives an account of the pyrophosphate solution which has now found commercial application in this country. The world shortage of nickel in the electroplating industry coupled with the ever increasing rise in polishing costs has accentuated the need for an easily buffed undercoat for nickel. In this way the imperfections of the base material can be readily flowed over thus reducing polishing costs as well as making full use of available nickel supplies by depositing bright nickel on the polished copper base. From everyday experience in the motor car and domestic appliance industries it would appear that the service life of this copper-nickel-chromium system compares favourably with ordinary nickel-chromium plating.
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