Abstract:Abstract Quantum bits, or qubits, are an example of coherent circuits envisioned for next-generation computers and detectors. A robust superconducting qubit with a coherent lifetime of O (100 μs) is the transmon: a Josephson junction functioning as a non-linear inductor shunted with a capacitor to form an anharmonic oscillator. In a complex device with many such transmons, precise control over each qubit frequency is often required, and thus variations of the junction area and tunnel barrier thickness must be sufficiently minimized to achieve optimal performance while avoiding spectral overlap between neighboring circuits. Simply transplanting our recipe optimized for single, stand-alone devices to wafer-scale (producing 64, 1x1 cm dies from a 150 mm wafer) initially resulted in global drifts in room-temperature tunneling resistance of ± 30%. Inferring a critical current I c variation from this resistance distribution, we present an optimized process developed from a systematic 38 wafer study that results in < 3.5% relative standard deviation (RSD) in critical current ( ≡ σ I c / I c ) for 3000 Josephson junctions (both single-junctions and asymmetric SQUIDs) across an area of 49 cm 2 . Looking within a 1x1 cm moving window across the substrate gives an estimate of the variation characteristic of a given qubit chip. Our best process, utilizing ultrasonically assisted development, uniform ashing, and dynamic oxidation has shown σ I c / I c = 1.8% within 1x1 cm, on average, with a few 1x1 cm areas having σ I c / I c < 1.0% (equivalent to σ f / f < 0.5%). Such stability would drastically improve the yield of multi-junction chips with strict critical current requirements.

Superconducting qubits at scale

Superconducting qubits on silicon substrates for quantum device integration

High-coherence superconducting qubits made using industry-standard, advanced semiconductor manufacturing

Advanced CMOS manufacturing of superconducting qubits on 300 mm wafers

A 300 mm foundry silicon spin qubit unit cell exceeding 99% fidelity in all operations

Multiplexed quantum transport using commercial off-the-shelf CMOS at sub-kelvin temperatures

Development of transmon qubits solely from optical lithography on 300mm wafers

Superconducting Qubits Above 20 GHz Operating over 200 mK

Probing single electrons across 300 mm spin qubit wafers

Optimization of shadow evaporation and oxidation for reproducible quantum Josephson junction circuits

Improving wafer-scale Josephson junction resistance variation in superconducting quantum coherent circuits

New material platform for superconducting transmon qubits with coherence times exceeding 0.3 milliseconds

Fabrication of Al/AlOx/Al Josephson Junctions on Silicon and Sapphire Substrates Using a Cold-Development Technique

Mitigation of interfacial dielectric loss in aluminum-on-silicon superconducting qubits

Overlap junctions for high coherence superconducting qubits

Mitigation of frequency collisions in superconducting quantum processors

Fabrication of Al/AlO x /Al Josephson junctions on silicon and sapphire substrates using a cold-development technique

Qubits made by advanced semiconductor manufacturing

Miniaturizing Transmon Qubits Using van der Waals Materials

Enhanced coherence of all-nitride superconducting qubits epitaxially grown on silicon substrate