Effect of ARB process on the plane stress fracture toughness, creep properties and forming limit diagram of Aluminum/BN/Copper composite strips

Din Bandhu,Saade Abdalkareem Jasim,Ahmed Raza Khan,Mandeep Kaur,Harpreet Kaur,R. Meenakshi Reddy,F Naderian

DOI: https://doi.org/10.1088/1402-4896/ad6498

2024-07-18

Physica Scripta

Abstract:In the present study, Al/BN/Cu bimetal composite strips were fabricated via the accumulative roll bonding (ARB) process. Then, fracture toughness, mechanical properties, bonding strength, forming limit diagram (FLD), and creep properties have been studied via experimental techniques. The study of creep behavior and mechanical properties showed a formation of a 17 μm atomic diffusion layer at the interface during ARB under three creep loading conditions namely 35 MPa at 225 °C, 35 MPa at 275 °C, and 30 MPa at 225 °C. The tensile strength of samples improved to 144 MPa which was about 234% in comparison with the primary Al monolithic sample. It was observed by the SEM that the fracture types changed to shear kind after higher passes including prominent effects on the fracture morphology. FLD curve dropped severely after the first ARB pass and then began to enhance at higher passes. The fracture toughness value of 30 MPam1/2 was achieved after ten ARB passes. An intermetallic composition was created near Al. The creep failure time did decline by 44% and the stress level decreased by 13% at a constant temperature. It can be concluded that applied temperature and stress effect on creep properties especially leads to increasing the slope of creep curves with higher stresses. This trend was opposite for the creep temperature at higher temperature levels. Moreover, dynamic recrystallization was observed through the crystalline structure of samples.

physics, multidisciplinary