Thermal Analysis and Optimal Design of Artillery Integrated Electronic Case Based on FloEFD

Zhipeng Zhang,Zhong Li,Haohao Cui,Jiachen Guo,Yanfeng Liu
DOI: https://doi.org/10.1088/1742-6596/2478/12/122051
2023-06-01
Journal of Physics: Conference Series
Abstract:Abstract With the highly integrated artillery integrated electronic system, the power density in the integrated electronic chassis has risen sharply, and the temperature has also risen sharply. In order to solve the heat dissipation problem of the artillery integrated electronic case, this article firstly designs the artillery integrated electronic case according to the technical requirements, and uses heat density calculation and heat dissipation simulation technology to model and simulate the heat dissipation of the artillery integrated electronic case. According to the simulation results, conduct thermal analysis and optimization design of the chassis, and finally conduct a temperature test experiment with an infrared imager. The experimental results show that the heat dissipation simulation method can reflect the heat dissipation of the chassis more accurately and effectively, and lays a technical foundation for the application of temperature digital twin technology in the integrated electronic system of artillery.
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