Simulation of Heat Dissipation in a Closed Enclosure Based On Flotherm

Weibo Que,Qiang Zhang,Dehuai Zeng,Chenxue Wang
DOI: https://doi.org/10.1088/1755-1315/252/3/032136
2019-07-09
IOP Conference Series: Earth and Environmental Science
Abstract:As an important method to measure the reliability of electronic products, thermal simulation is widely used in product life prediction and reliability optimization. In this paper, the relationship between the working temperature and working performance of power components and the importance of thermal simulation analysis are discussed. The basic theory of thermal analysis software Flotherm is expounded. The functional characteristics and application range of Flotherm software are introduced. The chassis power device is designed. The boundary condition setting, grid setting, and result processing of the simulation model are introduced in detail. The results illustrate that the maximum temperature of the power components can be guaranteed within the specified temperature range, which satisfies the temperature requirements for reliable operation.
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