Abstract:The development of 5G technology has put forward new requirements for computing the abilities of chips, and chip power has also significantly increased. Consequently, the heat load of the rack will increase rapidly in the future. Traditional computer room air conditioning (CRAC) systems cannot satisfy the rack's high heat flux dissipation requirements, and new cooling forms such as chip-level cooling should be adopted. In this study, a two-stage chip-level cooling system, which is pumpless and waterless, offers flexible and detachable installation based on practical requirements, was proposed. The cooling system removes heat from the chips to the outdoors via two thermosiphon loops, where the heat is first transferred to cold plates tightly attached to the chip surfaces, then transferred through heat exchangers attached to the rack side, and finally dissipated outdoors through air cooling. In this study, a two-stage chip-cooling system was constructed and tested in an enthalpy-difference laboratory. The effects of the liquid filling ratio on the thermal resistance, total temperature difference, and fluid flow pattern under different heat loads were investigated. Second, a heat transfer model for analysing thermal resistance networks was constructed, and the proportions of different types of thermal resistance were determined. Third, an energy-saving analysis of the system is established. The experimental results showed that at single chip heat load 200 W and total heat load 2 kW, the heat transfer temperature difference between chips and outdoors is less than 20 degrees C at extremely high energy efficiency (cooling load factor reaches 0.05 at outdoor temperature 40 degrees C), which makes it feasible for free cooling throughout the year in most Chinese areas. The annual PUE in Beijing using the proposed system is 1.15, which indicates a 30 % reduction of the total energy consumption of data centres.

Finite Element Analysis of Thermoelectric Refrigeration on the Heat Surface of the Chip Packaging

Analysis of thermal spreading resistance in high power LED package and its design optimization

Analytical Modeling of Forced-Air Cooling Heatsink by Considering Air Temperature Rise in Channel and Coupling of Multiple Heat Sources

Design Optimization of Thermoelectric Cooling Systems for Applications in Electronic Devices

Simulation of Radiative Cooling with FETD Method

Comprehensive Thermal Resistance Model of Forced Air Cooling System for Multiple Power Chips

Optimum allocation of heat transfer surface area for cooling load and COP optimization of a thermoelectric refrigerator

Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices

Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets

A system level optimization of on-chip thermoelectric cooling via Taguchi-Grey method

Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods

Three-dimensional fluid-thermal–mechanical coupling numerical modeling of elastocaloric cooler for electronic chip

Experimental Research and Energy Effectiveness Analysis on Chip-Level Two-Stage Loop Thermosyphon System for Data Centre Free Cooling

Thermodynamic Analysis and Experimental Research of Water-Cooled Small Space Thermoelectric Air-Conditioner

Simulation of fluid flow and heat transfer in microchannel cooling for LTCC electronic packages

Thermoelectric Coolers for Hotspot Thermal Management of 3D Stacked Chips

Research On Thermal Management Technology of System- Level Electronic Integrated Package

Numerical evaluation on the heat dissipation capability of liquid metal based chip cooling device

Efficient Thermoelectric Cooler for Localized Cooling in Electronic Devices

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration