Abstract:Hydrogen is inevitably produced during electroless Cu plating, it accumulates on the Cu-surface, forms gas bubbles and sticks on the as-growing Cu surface. The encapsulation of these gas-bubbles in the electroless Cu layer results in nanoporous, low ductile and compressively stressed deposits with a high blister tendency, this process being known as "hydrogen embrittlement". In this context, the present paper investigates the nanovoid density in electroless Cu films as a function of Ni0 co-deposition. The Ni0 co-deposition was varied by ranging the Ni2+-concentration in the bath from 0 ppm to 2000 ppm, as well as by using different single stabilizer components at a constant Ni2+-concentration of 400 ppm in the bath. A standardized and optimized sample preparation utilizing focused ion beam(FIB) and scanning electron microscopy (SEM) inspection enables automatic image processing of the SEM-micrographs to quantify the void density of the deposits down to a void size of 10 nm. A minimum addition of 30 ppm Ni2+ in the electroless Cu bath prevents the encapsulation of hydrogen bubbles during Cu growth and leads to solid, nanoscopically defect-free layers, which have been confirmed by transmission electron microscopy. Additionally, deposits with a high Ni0-incorporation up to the miscibility limit of Ni in Cu (4 at. %) are nanoscopically defect-free. In contrast to Ni2+, the addition of single organic additives, commonly used to stabilize the electroless Cu bath, provokes a substantial increase of the nanoporosity of the deposit. The results were discussed in terms of a different Cugrowth mode caused by the co-deposition of Ni0. The results will have implications on the development of low/no-Ni electroless Cu baths, e.g. EDTA-based baths, as well as to applications where the integrity and thermo-mechanical stability of electroless Cu plays a crucial role.

Processes of formation of Cu–Ni alloy films by electron beam evaporation

Thermodynamic Modeling of the Deposition of Nickel-Containing Films from the Gas Phase

Co-precipitated Ni/Mn Shell Coated Nano Cu-rich Core Structure: A Phase-Field Study

Electrodeposition of Ni–Co alloys from a deep eutectic solvent

Influence of Electrodeposition Conditions on the Microstructure and Corrosion Resistance of Zn–Ni Alloy Coatings from a Deep Eutectic Solvent

Grain boundary segregation and interdiffusion effects in nickel-copper alloys: an effective means to improve the thermal stability of nanocrystalline nickel.

Preparation of FeNiCoCrCu Thin Films by Ionized Jet Deposition Method: Determination of Elemental Transfer Coefficients

Phase Equilibria of the Ternary Ag-Cu-Ni System and the Interfacial Reactions in the Ag-Cu/Ni Couples

Nickel and copper deposition on fine alumina particles by using the chemical vapor deposition-circulation fluidized bed reactor technique

Thermal evolution of nanocrystalline co-sputtered Ni-Zr alloy films: Structural, magnetic and MD simulation studies

Study of Reactively Sputtered Nickel Nitride Thin Films

Study of the influence of vanadium and niobium on the structure of Ti-Al-V and Ti-Al-Nb alloys formed by selective electron beam alloying

Epitaxial (111) Films of Cu, Ni, and Cu$_xNi$_y$ on α-Al$_2$O$_3$(0001) for Graphene Growth by Chemical Vapor Deposition

Nickel thin films with bulk-like properties formed by the ion-beam sputtering – deposition cycles

Evolution of texture in electrodeposited Ni/Cu layered nanostructures

Influences of Co and process parameters on structure and corrosion properties of nanocrystalline Ni-W-Co ternary alloy film fabricated by electrodeposition at low current density

Nickel dependence of hydrogen co-deposition and nanoporosity in electrolessly deposited Cu-films

Interface Reaction between Tin Solder and Nanocrystalline Ni and Ni-Mo Coatings Obtained by Electrodeposition

Amorphization and Nano-Crystallization of Ni-Nb Coating on GH3039 Alloys by High Current Pulsed Electron Beam

Formation of Metastable Alloy Films in the Ni-Mo Binary System by Ion-Beam-assisted Deposition

Friction and Wear Characteristics of Electrodeposited Ni‐based Metallic Coatings on Cu‐substrate under High‐Temperature Conditions