Effect of ultrasonic shot peening on electrodeposited Ni and Cu coatings on Cu substrate

Sodanapalli Rehaman,Adarsh Kushwaha,A. Basu
DOI: https://doi.org/10.1016/j.matpr.2023.05.561
2023-06-06
Materials Today: Proceedings
Abstract:In this study, the effect of ultrasonic shot peening (USSP) on bilayered Ni and Cu coatings on Cu substrate was studied. On the Cu substrate, Ni and Cu coatings were sequentially electrodeposited followed by ultrasonic shot peening with a varying shot diameter and peening time. Apart from phase analysis and microscopy study of the coatings (before and after peening), hardness, compressive residual stress, wear, and corrosion resistances are also examined. Improvement of surface-mechanical properties and electrochemical properties were observed in specific peening conditions. There was also a noticeable improvement in residual compressive stress as an effect of peening.
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