The Variation of Physical Properties of Plasma‐Deposited Silicon Nitride and Oxynitride with Their Compositions
V. S. Nguyen,S. Burton,P. Pan
DOI: https://doi.org/10.1149/1.2115255
IF: 3.9
1984-10-01
Journal of The Electrochemical Society
Abstract:Silicon nitride and silicon oxynitride films with refractive indices varying from 1.60 to 1.95 were deposited on silicon substrates using plasma‐enhanced chemical vapor deposition (PECVD) processing. Variation of the film's physical properties with composition is examined. Refractive indices, infrared, Auger analysis, and plasma etching of plasma‐deposited films are studied before and after an annealing cycle. A direct correlation between etch rates and etch profiles of the deposited films with their composition was observed. Plasma etching, using a 92%CF4+8%O2 gas mixture, showed that the etch rate of oxynitride film increases with hydrogen concentration and decreases as the oxygen content increases. The length of the undercut, i.e., etch profile, depends on the amount of oxygen and hydrogen content in the films. Infrared data suggests that silicon oxynitride film with a refractive index of 1.75 is more stable under thermal annealing cycles, as compared to other silicon oxynitride films. Ellipsometric measurements showed that film thickness and refractive index uniformity are comparable with those of CVD processing. However, Auger depth profile analysis revealed poor compositional uniformity in all deposited films, especially at the silicon or silicon dioxide substrate interfaces.
electrochemistry,materials science, coatings & films