Abstract:When the temperature of the package assembly is changed, non‐uniform deformation and local stress may occur owing to the different thermal expansion coefficients of the constituent materials, while concentrated thermal stress may cause significant failure. In this study, we carry out an experiment and analysis of the thermal deformation of a flip chip plastic ball grid array package with respect to temperature change. Interference fringe patterns representing the displacement distribution of each temperature stage are obtained using a Moiré interferometry and the bending deformation behavior and the strain of the solder ball are analyzed thereafter. We compare the deformation behavior of a single‐sided package assembly and a double‐sided package assembly. The effective strain, which significantly affects the failure of the solder ball, is found to be the largest in the solder ball just outside the edge of the chip in the case of the single‐sided package assembly. In the case of the double‐sided package assembly, the maximum effective strain is found in the solder ball just inside the edge of the chip, with a value approximately 50 % larger than in the case of the single‐sided package assembly. Wenn sich die Temperatur eines Gehäuses ändert, kann es aufgrund der unterschiedlichen Wärmeausdehnungskoeffizienten der einzelnen Werkstoffe zu ungleichmäßigen Verformungen und lokalen Spannungen kommen, während konzentrierte thermische Spannungen zu erheblichen Ausfällen führen können. In dieser Studie führen wir ein Experiment und eine Analyse der thermischen Verformung einer Flip‐Chip Kunststoffkugel Gitteranordnung in Abhängigkeit von der Temperaturänderung durch. Mit Hilfe der Moiré‐Interferometrie werden Interferenzstreifenmuster aufgenommen, die die Verschiebungsverteilung jeder Temperaturstufe darstellen und anschließend werden das Biegeverformungsverhalten und die Dehnung der Lötkugel analysiert. Wir vergleichen das Verformungsverhalten einer einseitigen und einer doppelseitigen Gehäusebaugruppe. Es zeigt sich, dass die effektive Dehnung, die das Versagen der Lötkugel maßgeblich beeinflusst, im Fall der einseitigen Baugruppe in der Lötkugel direkt außerhalb des Chiprands am größten ist. Bei der doppelseitigen Baugruppe ist die maximale effektive Dehnung in der Lötkugel direkt innerhalb des Chiprands zu finden, mit einem Wert der etwa 50 % größer ist als bei der einseitigen Baugruppe. In this study, the thermo‐mechanical deformation behavior of flip chip plastic ball grid array packages was analyzed using Moiré interferometry. Interference fringe patterns representing the displacement distribution of each temperature stage were recorded at each temperature stage, and clear fringes were obtained. The bending deformation behavior and the strain of the solder ball are analyzed.

Deformation behaviors of flip chip plastic ball grid array packages subjected to temperature change using moiré interferometry

Thermo‐mechanical behavior of ball grid packages with different solder ball grid patterns investigated through moiré interferometryThermomechanisches Verhalten von Kugelgitterpackungen mit unterschiedlichen Lotkugelgittermustern, untersucht durch Moiré‐Interferometrie

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