Abstract:Negative photosensitive polyimides (PSPIs) with the photo-patterned ability via the photocrosslinking reactions induced by the i-line (365 nm) and h-line (426 nm) emitting wavelengths in high-pressure mercury lamps have been paid increasing attention in semiconductor fabrication, optical fiber communications, and other advanced optoelectronic areas. In the current work, in view of the optical and thermo-mechanical disadvantages of the currently used negative PSPIs, such as the intrinsically photosensitive or auto-photosensitive systems derived from 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and the ortho-alkyl- substituted aromatic diamines, a series of modified negative PSPIs with the enhanced optical transparency in the wavelength of 365~436 nm and apparently reduced coefficients of linear thermal expansion (CTE) were developed. For this purpose, a specific aromatic diamine with both of trifluoromethyl and benzanilide units in the molecular structures, 2,2'-bis(trifluoromethyl)-4,4'-bis[4-(4-amino-3-methyl)benzamide]biphenyl (MABTFMB) was copolymerized with BTDA and the standard 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane (TMMDA) diamine via a two-step chemical imidization procedure. As compared with the pristine PI-1 (BTDA-TMMDA) system, the new-developed fluoro-containing PSPI systems (FPI-2~FPI-7) exhibited the same-level solubility in polar aprotic solvents, including N-methyl-2-pyrrolidone (NMP) and N,N- dimethylacetamide (DMAc). The FPI films cast from the corresponding FPI solutions in NMP showed the optical transmittances of 78.3–81.3% at the wavelength of 436 nm (T436, h-line), which were much higher than that of the PI-1 (T436 = 60.9%). The FPI films showed the CTE values in the range of 40.7 × 10−6/K to 54.0 × 10−6/K in the temperature range of 50 to 250 °C, which were obviously lower than that of PI-1 (CTE = 56.5 × 10−6/K). At last, the photosensitivity of the FPI systems was maintained and the micro-pattern with the line width of 10 μm could be clearly obtained via the standard photolithography process of FPI-7 with the molar ratio of 50% for MABTFMB in the diamine moiety.

Novel low‐temperature curable photosensitive polyimides with stable storage

Low-Temperature Curable Negative-Tone Photosensitive Polyimides: Structure and Properties

Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole

Constructing High Performance Low-temperature Curable PI Materials by Manipulating the Side Group Effects of Diamine

A comprehensive study on the effect of molecular chain flexibility on the low-temperature curing ability of polyimides

Exploring The Impact of Blend And Graft of Quinoline Derivative in Low‐temperature Curable Polyimides

Intrinsically Negative Photosensitive Polyimides with Enhanced High-Temperature Dimensional Stability and Optical Transparency for Advanced Optical Applications via Simultaneous Incorporation of Trifluoromethyl and Benzanilide Units: Preparation and Properties

Aminoquinoline-functionalized fluorographene quantum dots for low-temperature curable and low-dielectric photosensitive polyimide nanocomposites

Progress on the research and application of low-temperature curable photosensitive polyimides for microelectronic packaging

Synthesis and Characterization of Negative-Tone Photosensitive Polyimides with Low Coefficient of Thermal Expansion for Packaging Applications

An ultra heat-resistant polyimide formulated with photo-base generator for alkaline-developable, negative-type photoresist

Benzophenone‐containing methylthiomethyl pendant polyimides as negative acting photoresists

A Novel Negative Photoinitiator-Free Photosensitive Polyimide

Tuning the Heat Resistance Properties of Polyimides by Intermolecular Interaction Strengthening for Flexible Substrate Application

Photo‐Curable Fluorinated High‐k Polyimide Dielectrics by Polar Side Substitution Effect for Low‐Voltage Operating Flexible Printed Electronics

Quaternary Copolymerized Polyimides and Negative Photosensitive Polyimide: Preparation and Properties

Negative-working Photosensitive Polyimide

Achieving Both Low Thermal Expansion and Low Birefringence for Polyimides by Regulating Chain Structures

Novel semi-N-methyl substituted bisbenzimidazole based polyimide films with low coefficient of thermal expansion and high Tg

Cure Kinetics and Thermal Decomposition Behavior of Novel Phenylacetylene-Capped Polyimide Resins

Colorless transparent and thermally stable terphenyl polyimides with various small side groups for substrate application