Progress on the research and application of low-temperature curable photosensitive polyimides for microelectronic packaging

REN Xi,HE Zhi-bin,GAO Yan-shuang,WANG Zhen-zhong,HAN Shu-jun,QI Yue-xin,ZHI Xin-xin,YU Hai-feng,LIU Jin-gang
DOI: https://doi.org/10.19482/j.cn11-3237.2023.12.02
2023-01-01
Abstract:The current research and application status of low-temperature curable photosensitive polyimides(PSPIs)have been reviewed.The property requirements of integrated circuits(IC)packaging to the PSPI materials,the structural design and preparation chemistry of negative and positive PSPIs,and the main procedures for achieving the low-temperature curability of PSPIs were mainly introduced.Emphatically,the current research and development status,potential engineering applications,and future developing trends of the low-temperature curable PSPIs containing external crosslinkers were presented.
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