Investigation of the Influence of Alloy Atomic Doping on the Properties of Cu-Sn Alloys Based on First Principles

Zongfan Wei,Jiaying Chen,Jingteng Xue,Nan Qu,Yong Liu,Ling Sun,Yuchen Xiao,Baoan Wu,Jingchuan Zhu,Huiyi Tang

DOI: https://doi.org/10.3390/met14050552

IF: 2.695

2024-05-07

Metals

Abstract:In order to design Cu-Sn alloys with excellent overall performance, the structural stability, mechanical properties, and electronic structure of X-doped Cu-Sn alloys were systematically calculated using first-principles calculations. The calculation results of the cohesive energy indicate that the Cu-Sn-X structures formed by X atoms (X = Ag, Ca, Cd, Mg, Ni, Zr) doping into Cu-Sn can stably exist. The Cu-Sn-Ni structure is the most stable, with a cohesive energy value of −3.84 eV. Doping of X atoms leads to a decrease in the bulk modulus, Possion's ratio and B/G ratio. However, doping Ag and Ni atoms can improve the shear modulus, Young's modulus, and strain energy of the dislocation. The doping of Ni has the highest enhancement on shear modulus, Young's modulus, and strain energy of the dislocation, with respective values as follows: 63.085 GPa, 163.593 GPa, and 1.689 W/J·m−1. The analysis of electronic structure results shows that the covalent bond between Cu and X is the reason for the performance differences in Cu-Sn-X structures.

materials science, multidisciplinary,metallurgy & metallurgical engineering

What problem does this paper attempt to address?

This paper aims to study the effects of doping X atoms (X = Ag, Ca, Cd, Mg, Ni, Zr) into Cu - Sn alloys on the structural stability, mechanical properties and electronic structure of the alloys through first - principles calculations. Specifically, the objectives of the paper include: 1. **Structural stability**: The influence of different doping elements on the structural stability of Cu - Sn alloys was evaluated by calculating the cohesive energy. The results show that the Cu - Sn - Ni structure is the most stable, with a cohesive energy value of - 3.84 eV. 2. **Mechanical properties**: The changes in the bulk modulus, Poisson's ratio, B/G ratio, shear modulus, Young's modulus and dislocation strain energy of Cu - Sn alloys after doping with X atoms were studied. The main findings are as follows: - Doping with X atoms leads to a decrease in the bulk modulus, Poisson's ratio and B/G ratio. - Doping with Ag and Ni atoms can increase the shear modulus, Young's modulus and dislocation strain energy, among which Ni has the most significant enhancement effect, increasing by 63.085 GPa, 163.593 GPa and 1.689 W/J·m\(^{-1}\) respectively. 3. **Electronic structure**: The changes in the electronic structure of Cu - Sn and Cu - Sn - X alloys were explored by analyzing the electronic density of states, occupation numbers and differential charge density. The results show that the covalent bond between Cu and X is the reason for the differences in the structural properties of Cu - Sn - X. In general, through systematic theoretical calculations, this paper reveals the specific effects of different doping elements on the properties of Cu - Sn alloys, providing a theoretical basis for the design of Cu - Sn alloys with excellent comprehensive properties.

Investigation of the Influence of Alloy Atomic Doping on the Properties of Cu-Sn Alloys Based on First Principles

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