Intensified chipping during nanoindentation and the effect of friction on the interfacial fracture for thin films used in N/MEMS

Ritambhara Dash,Kushal Bhattacharyya,R.P. Kumar,A S Bhattacharyya
DOI: https://doi.org/10.1088/2631-8695/ac9c85
IF: 1.7
2022-10-22
Engineering Research Express
Abstract:Nanoindentation was performed on Ti-B-Si-C and SiCN films deposited on Si substrates at varying loads and depths of penetrations. The intensity of chipping got enhanced with an increasing load which was represented geometrically. The pop-in and pop-out events occurring in the load and unloading were explained as cracking and high-pressure phase transformation. The interfacial fracture stability and adhesion of the film-substrate system, crucial for N/MEMS devices were analyzed with respect to frictional coefficient with the help of Finite Element Modelling (FEM).
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